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<title><![CDATA[EC21 Product Catalogs - soldering materials]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/soldering_materials--100303/1/soldering materials.html]]></link><item>
<title><![CDATA[Wave/Reflow Soldering Pallet Materials]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Wave_Reflow_Soldering_Pallet_Materials--12036090_12036092.html]]></link><description><![CDATA[during soldering, leading to higher yield rates in production.
T315 is widely used in electronics manufacturing, where high-quality and reliable materials are essential for producing complex PCBs.
]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Solder Pallet Material]]></title><link><![CDATA[https://changdacm.en.ec21.com/Solder_Pallet_Material--5088980_5088981.html]]></link><description><![CDATA[Solder pallet material is glass fiber composites specifically designed to meet the various challenges of the PCB assembly process.
Features and benefits:
All materials are dimensionally stable and re]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[Material is suitable to wave soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low therma]]></description><pubDate><![CDATA[20120409]]></pubDate></item>
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<title><![CDATA[3:1 Shrink Ratio Waterproof Solder Ring Heat Shrink Terminal for Wire Insulation]]></title><link><![CDATA[https://keyusce.en.ec21.com/3_1_Shrink_Ratio_Waterproof--12062222_12062712.html]]></link><description><![CDATA[Heat Shrink Solder Connectors
Heat Shrink Solder Connectors are practical electrical terminals. They are made of transparent PE heat shrinkable tube material, with a identification ring on the tube b]]></description><pubDate><![CDATA[20260305]]></pubDate></item>
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<title><![CDATA[Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Sil_Pad_Tsp_Q2500--11478029_11501480.html]]></link><description><![CDATA[material to replacemessy thermal grease compounds.BERGQUIST Q2 eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST QII c]]></description><pubDate><![CDATA[20240822]]></pubDate></item>
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<title><![CDATA[Waterproof Insulation Heat Shrink Shrinkable Sleeve Tube Wrap Rolls Tubing]]></title><link><![CDATA[https://31654326548.en.ec21.com/Waterproof_Insulation_Heat_Shrink_Shrinkable--11954843_11954981.html]]></link><description><![CDATA[Specification
Mainly used for wire connection, solder joint protection, wire end harness, electronic device protection and insulation treatment, parts and metal surface protection, related product ru]]></description><pubDate><![CDATA[20240621]]></pubDate></item>
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<title><![CDATA[Anti-static ESD Polyimide Tape for PCB Manufacturing for Huayuan]]></title><link><![CDATA[https://huayuan2019.en.ec21.com/Anti_static_ESD_Polyimide_Tape--10924511_11188957.html]]></link><description><![CDATA[finger when PCB board in soldering tin furnace, insulation of 
coil, wave-soldering protection, electrical insulation, high temperature
resistance, etc. No residue leaving after tape removed.
]]></description><pubDate><![CDATA[20240218]]></pubDate></item>
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<title><![CDATA[Precision of A Die-cutting]]></title><link><![CDATA[https://linh123.en.ec21.com/Precision_of_A_Die_cutting--7688678_7825711.html]]></link><description><![CDATA[digital video cameras, laptops, mobile phones, cars, instruments, and other electronic communications, digital IT products accessories, medical equipment, MT tin furnace, wave soldering, etc...
]]></description><pubDate><![CDATA[20160418]]></pubDate></item>
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<title><![CDATA[Hot Melt Aluminum Foil Mylar Tape]]></title><link><![CDATA[https://filmtape.en.ec21.com/Hot_Melt_Aluminum_Foil_Mylar--11729864_11729904.html]]></link><description><![CDATA[soldering tin,
Parameters:
Material: Cu 99.98%
Substrate thickness: 0.018mm-0.05mm
Adhesive thickness: 0.035mm
Colloidal composition: conductive adhesive (heat sensitive acrylic adhesive)
Adhesion: 1]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

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