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<title><![CDATA[EC21 Product Catalogs - soldering process]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/soldering_process--100303/1/soldering process.html]]></link><item>
<title><![CDATA[Soldering Tinned Ring Intermediate Terminal Tinned Heat Shrink Insulated Wire Joiner Connnector]]></title><link><![CDATA[https://keyusce.en.ec21.com/Soldering_Tinned_Ring_Intermediate_Terminal--12062222_12062838.html]]></link><description><![CDATA[Heat shrink soldering tin insulation terminal
Heat shrink soldering tin insulation terminal’s outer layer is the transparent PE heat shrink sleeve, The inner layer is made of identifiable hot melt ]]></description><pubDate><![CDATA[20260310]]></pubDate></item>
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<title><![CDATA[Polyimide Tape]]></title><link><![CDATA[https://citchem.en.ec21.com/Polyimide_Tape--5741528_5741544.html]]></link><description><![CDATA[soldering and reflow soldering processes within the PCB assembly industry. It is used in electrical insulation application meeting class H requirements.
Main Features: 
. Thin and conformable enablin]]></description><pubDate><![CDATA[20250310]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials Laminates/Wave Soldering/Reflow Soldering Pallets Fixtures]]></title><link><![CDATA[https://tfuermaterials.en.ec21.com/Solder_Pallet_Materials_Laminates_Wave--12036090_12036091.html]]></link><description><![CDATA[solder pallets due to its excellent heat resistance and structural stability. The material can withstand the high temperatures encountered during wave soldering or reflow soldering processes.
PCB Sup]]></description><pubDate><![CDATA[20250111]]></pubDate></item>
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<title><![CDATA[Solder Pallet Material]]></title><link><![CDATA[https://changdacm.en.ec21.com/Solder_Pallet_Material--5088980_5088981.html]]></link><description><![CDATA[Solder pallet material is glass fiber composites specifically designed to meet the various challenges of the PCB assembly process.
Features and benefits:
All materials are dimensionally stable and re]]></description><pubDate><![CDATA[20241125]]></pubDate></item>
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<title><![CDATA[Black Kapton Tape]]></title><link><![CDATA[https://hopelightcn.en.ec21.com/Black_Kapton_Tape--11317718_11317724.html]]></link><description><![CDATA[processing is high cost performance! Special specifications can be special processing.
Application Of Black Kapton Tape
Electronic products are fixed by reflow soldering, and the characteristics of g]]></description><pubDate><![CDATA[20210105]]></pubDate></item>
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<title><![CDATA[BERGQUIST Q-Pad 3  SIL PAD TSP Q2000]]></title><link><![CDATA[https://echo19820828.en.ec21.com/BERGQUIST_Q_Pad_3_SIL--11478029_11482723.html]]></link><description><![CDATA[BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and c]]></description><pubDate><![CDATA[20220914]]></pubDate></item>
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<title><![CDATA[Solder Pallet Materials]]></title><link><![CDATA[https://dwcmcoltd.en.ec21.com/Solder_Pallet_Materials--3950532_3950533.html]]></link><description><![CDATA[soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low thermal conductivity of the duroton]]></description><pubDate><![CDATA[20120409]]></pubDate></item>
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<title><![CDATA[Precision of A Die-cutting]]></title><link><![CDATA[https://linh123.en.ec21.com/Precision_of_A_Die_cutting--7688678_7825711.html]]></link><description><![CDATA[digital video cameras, laptops, mobile phones, cars, instruments, and other electronic communications, digital IT products accessories, medical equipment, MT tin furnace, wave soldering, etc...
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