<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - surface mount motor]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/surface_mount_motor--100303/1/surface mount motor.html]]></link><item>
<title><![CDATA[Thermally Conductive Insulator Silpad BM-K10 Silicone-coated Fiberglass Sheet for Mosfet for IGBT]]></title><link><![CDATA[https://szjrft2014.en.ec21.com/Thermally_Conductive_Insulator_Silpad_BM--11869813_11992983.html]]></link><description><![CDATA[surface, suitable for the insulation and thermal conductive of power device.
Applications:
1.Large power source and automobile electronic heating module.
2.Motor control, communication equipment.
3.P]]></description><pubDate><![CDATA[20240827]]></pubDate></item>
<item>
<title><![CDATA[Double Side Thermal Conductive Adhesive Tape for Chip PCB LED Strip]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Double_Side_Thermal_Conductive_Adhesive--11935710_11976738.html]]></link><description><![CDATA[surfaces double sided pressure sensitive adhesive tape
Applications
&gt; Mount heat sink onto BGA graphic processor or drive processor
&gt; Mount heat spreader onto power converter PCB or onto motor contro]]></description><pubDate><![CDATA[20240729]]></pubDate></item>
<item>
<title><![CDATA[Sil Pad Tsp 1800 Sil Pad 1200 Bergquist SP1200]]></title><link><![CDATA[https://evita0828.en.ec21.com/Sil_Pad_Tsp_1800_Sil--11451854_11451870.html]]></link><description><![CDATA[BERGQUIST SP1200 is a silicone based,fiberglass-reinforced thermal interface material featuringa smooth,highly compliant surface.The mate-rial features a non-tacky surface for efficientre-positioning]]></description><pubDate><![CDATA[20240618]]></pubDate></item>
<item>
<title><![CDATA[Bergquist SP900S Sil Pad 900s  SIL PAD TSP 1600S]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_SP900S_Sil_Pad_900s--11478029_11482724.html]]></link><description><![CDATA[mounting pressures for componentclamping.BERGQUIST SIL PAD 900S AC (SIL PAD TSP 1600S AC)material combines a smooth and highly compliant surface characteristic with high thermalconductivity. These ]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

</channel>
</rss>