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<title><![CDATA[EC21 Product Catalogs - semiconductor packaging test]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_packaging_test--100103/1/semiconductor packaging test.html]]></link><item>
<title><![CDATA[LM358DR Industry Standard Dual General Purpose Operational Amplifier 2Circuit 8SOIC Texas Instrument]]></title><link><![CDATA[https://njhser.en.ec21.com/LM358DR_Industry_Standard_Dual_General--11951003_11951144.html]]></link><description><![CDATA[package packaging, the final transaction price involves unpacking and repackaging according to the required quantity, and the final transaction price is subject to confirmation by our sales.
Best reg]]></description><pubDate><![CDATA[20240613]]></pubDate></item>
<item>
<title><![CDATA[Active Integrated Circuits (ICs) Electronic Components for Sale]]></title><link><![CDATA[https://electroniccomponents.en.ec21.com/Active_Integrated_Circuits_ICs_Electronic--11876864_11876865.html]]></link><description><![CDATA[Package: 1000/packageFunction: ELECTRONIC COMPONENTSSeries: Integrated CircuitsType: Integrated Circuits (ICs)Semiconductor Chips, Electronic Chips, Integrated Circuits Technical Parameters:Attribute]]></description><pubDate><![CDATA[20231218]]></pubDate></item>
<item>
<title><![CDATA[OEM SEMI Chip]]></title><link><![CDATA[https://walliam999.en.ec21.com/OEM_SEMI_Chip--6542750_6705733.html]]></link><description><![CDATA[4. ion implantation
5. Semiconductor chip package DualIn－line Package Plastic Quad Flat Package Plastic Flat Package Chip Scale Package Pin Grid Array Package Ball Grid Array Package 6. test
]]></description><pubDate><![CDATA[20120520]]></pubDate></item>

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