Min. Order:
10 Unit
Price:
US$ 384
Place of origin:
China
Application
Bonder: Utilized in the precise assembly of electronic circuit components.
Semiconductor Production Equipment: Employed in the precise manipulation of wafer and chip production processes.
Packaging Machines: Ideal for high-speed, accurate packaging and labeling tasks.
Inspection Equipment: Used for precise motion control required in accurate testing and measurement.
Robot Arms: Provid
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