<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - etched label die]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/etched_label_die--2629/1/etched label die.html]]></link><item>
<title><![CDATA[Piotec Smart Card Making Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/Piotec_Smart_Card_Making_Machine--11883003_11941753.html]]></link><description><![CDATA[etched onto the wafer.
Dicing: Once the wafer has been fabricated, it is cut into individual chips. This process is known as dicing.
Packaging: The individual chips are then packaged to protect them ]]></description><pubDate><![CDATA[20240524]]></pubDate></item>

</channel>
</rss>