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<title><![CDATA[EC21 Product Catalogs - surface tension measurement]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/surface_tension_measurement--2629/1/surface tension measurement.html]]></link><item>
<title><![CDATA[PTCME302 Chip Module Encapsulation Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/PTCME302_Chip_Module_Encapsulation_Machine--11883003_11883016.html]]></link><description><![CDATA[PTCME302 represents a new generation of high-speed smart card module adhesive packaging, packaging thickness measurement, and packaging appearance inspection system.
100% online control of the entire]]></description><pubDate><![CDATA[20240103]]></pubDate></item>
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<title><![CDATA[BHJG400 Bucking Machine]]></title><link><![CDATA[https://lzbhmachine.en.ec21.com/BHJG400_Bucking_Machine--11540564_11540566.html]]></link><description><![CDATA[surface to make the clamping reliable, the die marks are according to API standard, the clamp head can reset automatically and quick.
4. The structure and clamping principle of backup tong is the sam]]></description><pubDate><![CDATA[20220308]]></pubDate></item>

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