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<title><![CDATA[EC21 Product Catalogs - wafer chip package]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/wafer_chip_package--2629/1/wafer chip package.html]]></link><item>
<title><![CDATA[Piotec Smart Card Making Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/Piotec_Smart_Card_Making_Machine--11883003_11941753.html]]></link><description><![CDATA[wafer.
Dicing: Once the wafer has been fabricated, it is cut into individual chips. This process is known as dicing.
Packaging: The individual chips are then packaged to protect them from physical da]]></description><pubDate><![CDATA[20240524]]></pubDate></item>

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