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<title><![CDATA[EC21 Product Catalogs - isntant]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/isntant--3022/1/isntant.html]]></link><item>
<title><![CDATA[Ultra Low Temp Metallized CPP Film for Chips Packaging]]></title><link><![CDATA[https://dzchem.en.ec21.com/Ultra-Low-Temp-Metallized-CPP--4847583_6709294.html]]></link><description><![CDATA[ultra low temp metallized CPP film for chips packaging
Application :
It is widely used as the lining of the compound food package,such as biscuits,isntant noodles,chocolate,puffing food etc
Thickness]]></description><pubDate><![CDATA[20140814]]></pubDate></item>

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