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<title><![CDATA[EC21 Product Catalogs - acquisition distribution layer]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/acquisition-distribution-layer--271305/1/acquisition distribution layer.html]]></link><item>
<title><![CDATA[GS400A Scanning Acoustic Microscopy (SAM)]]></title><link><![CDATA[https://nbhuafan.en.ec21.com/GS400A-Scanning-Acoustic-Microscopy--11544046_11544051.html]]></link><description><![CDATA[distribution in the semiconductor packages or materials using high frequency ultrasonic waves. It is very sensitive to bonding layer, so it can discover air holes, flaws, impurities and delaminations]]></description><pubDate><![CDATA[20220316]]></pubDate></item>

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