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<title><![CDATA[EC21 Product Catalogs - bga]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/bga--10120303/1/bga.html]]></link><item>
<title><![CDATA[Enig Bga PCB]]></title><link><![CDATA[https://chanyee.en.ec21.com/Enig_Bga_PCB--11457151_11596458.html]]></link><description><![CDATA[ENIG BGA
PCB 
Product Description:
BGA PCB Board
is a surface mount package for integrated circuits. BGAs can provide more interconnect pins than dual in-line or flat packs, each with solder balls. A]]></description><pubDate><![CDATA[20231124]]></pubDate></item>
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<title><![CDATA[10 Layers HAL BGA PCB]]></title><link><![CDATA[https://rcypcb.en.ec21.com/10_Layers_HAL_BGA_PCB--5377851_5377941.html]]></link><description><![CDATA[Layers: 10
Material: FR-4
Solder mask color: Green
Copper thickness: 1oz
Board thickness: 1.6mm
Surface finish: HAL
Packing: vacuum
Min. drilled hole size: 0.2mm
Certificate: UL, ISO 9001, ISO 14000,]]></description><pubDate><![CDATA[20130506]]></pubDate></item>
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<title><![CDATA[Heavy Duty Marine Sand Suction Pump Multilayer Assembled PCB Fabrication]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Heavy_Duty_Marine_Sand_Suction--10035716_10079487.html]]></link><description><![CDATA[BGA.
5, Components Sourcing.
6, Quick PCBA prototype.
7, X-ray test, the Internal Circuit Test (ICT) , Functional Test (FCT)
8, Sample and small batch order are accepted.
PCBA Service
Customer offers]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Alumina Ceramic Circuit Board OEM Motherboard Aluminum Nitride Board Circuit-Board Professional Manu]]></title><link><![CDATA[https://sncpcb.en.ec21.com/Alumina_Ceramic_Circuit_Board_OEM--11979593_11981251.html]]></link><description><![CDATA[BGA repair and reballing
6. ICT, Constant Temperature Burn-in and Function Test
7. Stencil,Cables and Enclosure building
8. Standard Packing and On time Delivery 
Main Products
The above are the main]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[SMT After Welding Pcba Processing Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/SMT_After_Welding_Pcba_Processing--10919275_11050450.html]]></link><description><![CDATA[BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Artificial Intelligence PCBA]]></title><link><![CDATA[https://mintecelec.en.ec21.com/Artificial_Intelligence_PCBA--11622218_11622213.html]]></link><description><![CDATA[BGA placement capacity and quality control capabilities are very mature.
With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~]]></description><pubDate><![CDATA[20231028]]></pubDate></item>
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<title><![CDATA[Turnkey PCB and PCB Assembly Service]]></title><link><![CDATA[https://mktpcb.en.ec21.com/Turnkey_PCB_and_PCB_Assembly--10712329_10712330.html]]></link><description><![CDATA[BGA X-Ray Inspection
Mixed Parts：SMT &amp; THD assembly
AOI Testing（Automated Optical Inspection）
BGA/Micro BGA/uBGA
ICT Testing （In-Circuit Testing）
QFN,POP &amp; lead-less chips
Functional Testin]]></description><pubDate><![CDATA[20180601]]></pubDate></item>

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