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<title><![CDATA[EC21 Product Catalogs - micro hole process]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/micro_hole_process--10120303/1/micro hole process.html]]></link><item>
<title><![CDATA[Heavy Duty Marine Sand Suction Pump Multilayer Assembled PCB Fabrication]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Heavy_Duty_Marine_Sand_Suction--10035716_10079487.html]]></link><description><![CDATA[Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Alumin]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[SMT PCB Assembly]]></title><link><![CDATA[https://mktpcb.en.ec21.com/SMT_PCB_Assembly--10712329_10712333.html]]></link><description><![CDATA[Hole Device /Parts （THD）
BGA X-Ray Inspection
Mixed Parts：SMT &amp; THD assembly
AOI Testing（Automated Optical Inspection）
BGA/Micro BGA/uBGA
ICT Testing （In-Circuit Testing）
QFN,POP &amp; lead]]></description><pubDate><![CDATA[20180601]]></pubDate></item>

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