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<title><![CDATA[EC21 Product Catalogs - pop can filling]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/pop_can_filling--10120303/1/pop can filling.html]]></link><item>
<title><![CDATA[SMT PCB Assembly]]></title><link><![CDATA[https://mktpcb.en.ec21.com/SMT_PCB_Assembly--10712329_10712333.html]]></link><description><![CDATA[POP &amp; lead-less chips
Functional Testing（at the board &amp; system level）
2800 pin-count BGA
Flying Probe
0201/1005 passive components
0.3/0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
Prototype ]]></description><pubDate><![CDATA[20180601]]></pubDate></item>

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