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<title><![CDATA[EC21 Product Catalogs - soldering process]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/soldering_process--10120303/1/soldering process.html]]></link><item>
<title><![CDATA[Heavy Duty Marine Sand Suction Pump Multilayer Assembled PCB Fabrication]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Heavy_Duty_Marine_Sand_Suction--10035716_10079487.html]]></link><description><![CDATA[Soldering, Semi-auto DIP
6, PCBA Test Equipment: ORT, Constant temperature and humidity chamber，3D CMM，X-Ray.
7, PCBA Test：ICT, Functional Circuit Test and X-ray test.
8, Package Processed：
0]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Double-Sided Multilayer PCB for Complex Circuit Designs Multilayer PCB for Home Automation Systems]]></title><link><![CDATA[https://sncpcb.en.ec21.com/Double_Sided_Multilayer_PCB_for--11979593_11979594.html]]></link><description><![CDATA[Solder Mask Clearance0.05mmPlug Hole Diameter0.25mm--0.60mmImpedance control Tolerance±10%Surface finish/treatmentHASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold FingerCompany Profile
Process
Certification]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[Rogers RO3210 High Frequency PCB]]></title><link><![CDATA[https://bcco.en.ec21.com/Rogers_RO3210_High_Frequency_PCB--10882619_11068800.html]]></link><description><![CDATA[process)
10.8 (design)
Layer count: 
2 Layer,
Multilayer, Hybrid PCB
Copper weight: 
0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
PCB thickness: 
25mil (0.635mm),
50mil (1.27mm)
PCB size: 
≤400mm X 500]]></description><pubDate><![CDATA[20230113]]></pubDate></item>
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<title><![CDATA[High Quality Inverter PCB Layout Design / High Quality Wireless Mouse PCB Layout Design]]></title><link><![CDATA[https://cttpcb.en.ec21.com/High_Quality_Inverter_PCB_Layout--10919275_11050430.html]]></link><description><![CDATA[Solder mask color: GreenWhiteRedBlueBlack
PCBA type: Electronics Manufacturing board
Layer: 1-48 Layers (include Rigid-Flex PCB)
PCB Fireproof: 94v0
PCB circuit board
Certificate: ISO/ISO/RoHS/TS1694]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Peelable S/M 2Layers Lead Free HASL FR4]]></title><link><![CDATA[https://chanyee.en.ec21.com/Peelable_S_M_2Layers_Lead--11457152_11869936.html]]></link><description><![CDATA[solder, the coating formed in the HASL process is thin and uniform compared to tin-lead solder formed under similar conditions.
The coating thickness can be checked by XRF (X-ray Fluorescence Spectro]]></description><pubDate><![CDATA[20231124]]></pubDate></item>
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<title><![CDATA[4OZ Heavy Copper 12 Layer PCB with ENIG]]></title><link><![CDATA[https://hjl39506147520.en.ec21.com/4OZ_Heavy_Copper_12_Layer--11890882_11907658.html]]></link><description><![CDATA[Solder mask Color
Green
Silkscreen Color
None
Surface Finishing
ENIG
Min.Quantity of Order
No MOQ
Certificate
UL, ISO 9001, ISO 14001
Difficulty
Heavy Copper
Processing capability
Base material: FR4/]]></description><pubDate><![CDATA[20240229]]></pubDate></item>
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<title><![CDATA[Automotive Electronics PCBA]]></title><link><![CDATA[https://mintecelec.en.ec21.com/Automotive_Electronics_PCBA--11622218_11656305.html]]></link><description><![CDATA[Process Capability
Solder paste printer printing accuracy: ±0.02mm
Printing Repeat positioning accuracy: ±0.0125mm
Equipment reject material rate: within 5 parts per million
Mounting component size]]></description><pubDate><![CDATA[20231028]]></pubDate></item>
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<title><![CDATA[SMT PCB Assembly]]></title><link><![CDATA[https://mktpcb.en.ec21.com/SMT_PCB_Assembly--10712329_10712333.html]]></link><description><![CDATA[solder Technology 
Alternative PCB finishes 
Engineering support always 
AOI test 
PCB Assembly is a process of mounting and assembling of Components on the PCB. It not only requires knowledge of PCB]]></description><pubDate><![CDATA[20180601]]></pubDate></item>

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