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<title><![CDATA[EC21 Product Catalogs - x ray thickness]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/x_ray_thickness--10120303/1/x ray thickness.html]]></link><item>
<title><![CDATA[Rogers PCB]]></title><link><![CDATA[https://karenxcepcb.en.ec21.com/Rogers_PCB--10524638_10524639.html]]></link><description><![CDATA[thickness: 0.2-2mm+/-10% 
Final copper: 0.5-10oz 
Min hole: 0.2mm 
Min line width/space: 4/4mil 
Min hole copper: 20&amp;mu;m/25&amp;mu;m 
Solder mask: green/blue/red/black/gray/white 
Legend: white/black/ye]]></description><pubDate><![CDATA[20170829]]></pubDate></item>
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<title><![CDATA[Professionally Customized Multilayer Impedance Controllable Communication 94v0 PCB]]></title><link><![CDATA[https://cesgatepcbec21.en.ec21.com/Professionally_Customized_Multilayer_Impedance_Controllable--11155667_11191255.html]]></link><description><![CDATA[etcTesting Service:AOI X-RAY Funcion TestPCB Tolerance of finished thickness:5%Tolerance of Impedence control:5%Wrap and twist:5%Minimun thickness of soldermask:10umMax board size:560*410mm
]]></description><pubDate><![CDATA[20200703]]></pubDate></item>
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<title><![CDATA[Peelable S/M 2Layers Lead Free HASL FR4]]></title><link><![CDATA[https://chanyee.en.ec21.com/Peelable_S_M_2Layers_Lead--11457152_11869936.html]]></link><description><![CDATA[thickness can be checked by XRF (X-ray Fluorescence Spectroscopy) technology.
Compressive stress is the driving force for whiskers (filaments protruding from the surface of a board with tin as the fi]]></description><pubDate><![CDATA[20231124]]></pubDate></item>

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