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<title><![CDATA[EC21 Product Catalogs - cas 75 36 5]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/cas_75_36_5--0539/1/cas 75 36 5.html]]></link><item>
<title><![CDATA[Electroplating Intermediates for Nickel,Cu, Zn Plating]]></title><link><![CDATA[https://janechoo.en.ec21.com/Electroplating_Intermediates_for_Nickel_Cu--3690110_3690166.html]]></link><description><![CDATA[CAS# 55947-46-1)
Electroplating intermediates for Cu plating:
1. DPS (N, N-dimethyl-dithiocarbamylpropyl sulfonic acid, sodium salt)(CAS #18880-36-9),
2. EDTP (Q75)N, N, N&apos;N&apos;-tetra(2-hydropropyl)ethy]]></description><pubDate><![CDATA[20120515]]></pubDate></item>

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