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<title><![CDATA[EC21 Product Catalogs - 3x3 technology]]></title>
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<title><![CDATA[Small Out-Line Package]]></title><link><![CDATA[https://oudenet.en.ec21.com/Small-Out-Line-Package--11792219_11792220.html]]></link><description><![CDATA[Technology) technology in the 1980s , SOJ (Small Out-Line J-Lead), PLCC (Plastic Leaded Chip Carrier), and QFP (Quad Flat Package) packaging methods. After the IC functions and the number of I/O pins]]></description><pubDate><![CDATA[20230518]]></pubDate></item>

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