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<title><![CDATA[EC21 Product Catalogs - packaging module]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/packaging-module--1013/1/packaging module.html]]></link><item>
<title><![CDATA[Aluminum Silicon Carbide IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Aluminum-Silicon-Carbide-IGBT-Base--12057378_12057488.html]]></link><description><![CDATA[modules generate a large amount of heat during operation. The AlSiC material is usually used to fabricate the IGBT substrate, and the high-power IGBT module is firmly packaged, so that the chip can b]]></description><pubDate><![CDATA[20260416]]></pubDate></item>
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<title><![CDATA[High Precision SC Ceramic Ferrule Zirconia Oxide Fiber Optic Connector 2.493mm Inner Diameter Low I]]></title><link><![CDATA[https://meticulab.en.ec21.com/High-Precision-SC-Ceramic-Ferrule--12070016_12070021.html]]></link><description><![CDATA[modules
Fiber optic sensors
Optical time-domain reflectometers (OTDR)
Spectrum analyzers and optical test equipment
Laboratory and educational optical communication platforms
🤝 We focus on technic]]></description><pubDate><![CDATA[20260414]]></pubDate></item>
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<title><![CDATA[EBYTE E22-400TBL-SC LoRa Module Development Board Offline Test Evaluation Kit]]></title><link><![CDATA[https://cdebyteiot.en.ec21.com/EBYTE-E22-400TBL-SC-LoRa--11947470_11947471.html]]></link><description><![CDATA[package-compatible wireless modules. The development board is soldered 
with the E22-400T22S model UART interface lora module, and the MCU uses 
the STM32F103C8T6, which is convenient for developers ]]></description><pubDate><![CDATA[20250320]]></pubDate></item>
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<title><![CDATA[5G Base Station Universal Baseband HUAWEI UMPTB4]]></title><link><![CDATA[https://huaxuntelecom.en.ec21.com/5G-Base-Station-Universal-Baseband--11941339_11941338.html]]></link><description><![CDATA[Product Description
Item
Value
Model Number
UMPTb4
Type
Baseband
Place of Origin
Hebei,China
Brand Name
HUAWEI
Use
Telecom Equipment
Warranty Time
1 Year
Condition
New Or Used
Package
As requirement
]]></description><pubDate><![CDATA[20240523]]></pubDate></item>
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<title><![CDATA[Samsung Electro-Mechanics Distributor]]></title><link><![CDATA[https://aoewing.en.ec21.com/Samsung-Electro-Mechanics-Distributor--9591920_9592072.html]]></link><description><![CDATA[Package Substrate，FPCB（SMT），Rigid-Flex，Adapter，Antenna，Camera Module，Cellular FEM，Digital Tuner，LED Lighting Power，Media Storage，Server Power，TV Power，Vibration，Wireless]]></description><pubDate><![CDATA[20150717]]></pubDate></item>
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<title><![CDATA[SKY77762-11]]></title><link><![CDATA[https://cqshan.en.ec21.com/SKY77762-11--11726710_11726728.html]]></link><description><![CDATA[module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 1850-1910 MHz bandwidth coverage into a single compact package. Because of]]></description><pubDate><![CDATA[20230213]]></pubDate></item>
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<title><![CDATA[Rof Electrical Optical Modulator Y Waveguide Modulator LINBO3 Phase Modulation]]></title><link><![CDATA[https://rofer10.en.ec21.com/Rof-Electrical-Optical-Modulator-Y--11791377_11791378.html]]></link><description><![CDATA[Packaging structurePackaging form
Metal or ceramicDevice size (excluding pins)
mm30×8×5Pigtail type
Small mode field (6.0mm) PM Fiber PM FiberFiber lengthLm≥1.0≥1.2Environmental indicatorsWorki]]></description><pubDate><![CDATA[20230517]]></pubDate></item>
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<title><![CDATA[Cortex-A8 TINY2107 Inch Touch Screen, Android 4.0]]></title><link><![CDATA[https://tymall.en.ec21.com/Cortex-A8-TINY2107-Inch-Touch--4823045_7271190.html]]></link><description><![CDATA[modules, especially the 7-inch LCD module Power supply: DC-5V
Package list:
The tiny210 core board (512M RAM +256 M Flash), and TinySDK2 development of reference backplane: 1 LCD module: 1 (model a S]]></description><pubDate><![CDATA[20121107]]></pubDate></item>
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<title><![CDATA[Dedicated 2.4G Wireless Mouse Receiving and Transmitting Modules with IC KA8, V108, PAW3205, MX8640]]></title><link><![CDATA[https://lulu1224.en.ec21.com/Dedicated-2.4G-Wireless-Mouse-Receiving--11178566_11179385.html]]></link><description><![CDATA[Modules with IC KA8 in Shenzhen, Guangdong, China. Our offered products are designed and developed by our reliable vendors using top grade material and innovative technology. Wireless mouse receiving]]></description><pubDate><![CDATA[20211008]]></pubDate></item>
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<title><![CDATA[Honeywell TDC3000]]></title><link><![CDATA[https://willingtech.en.ec21.com/Honeywell-TDC3000--4887724_4888124.html]]></link><description><![CDATA[MODULE 
AB 1746-A1O SLC500 10 SLOT ROCK 
AB 1746-A7 SLC500 7-SLOT ROCK 
AB 1746-C9 SLC500 CABLE ASSEMBLY FOR 36INCH RACK 
AB 1746-C9 SLC500 CABLE ASSEMBLY FOR 36INCH RACK 
AB 1746-IA16 SLC500 OUTPUT ]]></description><pubDate><![CDATA[20160607]]></pubDate></item>
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<title><![CDATA[AWG Mux Demux]]></title><link><![CDATA[https://opticalsintai.en.ec21.com/AWG-Mux-Demux--11459789_11459805.html]]></link><description><![CDATA[Module
The athermal Array Waveguide Grating Module (AWG) from Sintai is based on waveguide grating technology on the silicon substrates and adopts the unique thermal-free package design, which is a c]]></description><pubDate><![CDATA[20211015]]></pubDate></item>
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<title><![CDATA[Flip Chip COF ILB Bonding Chip-on-Film Manufacturer]]></title><link><![CDATA[https://homraytech.en.ec21.com/Flip-Chip-COF-ILB-Bonding--9302647_9302678.html]]></link><description><![CDATA[Film, Chip-on-Flex, New COF design and COF ILB chip bonding and COF Package module. 
COF IC FOR LCD PC MODULE 
PI THICKNESS 38&amp;mu;m 
CU THICKNESS 8&amp;mu;m 
MIN PITCH: 40 &amp;mu;m 
FOR LG OR SAMSUNG]]></description><pubDate><![CDATA[20141203]]></pubDate></item>

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