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<title><![CDATA[EC21 Product Catalogs - surface mounting technology]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/surface-mounting-technology--1013/1/surface mounting technology.html]]></link><item>
<title><![CDATA[VSMB1940ITX01 Infrared Emitters - High Power H. Speed IR 940nm Double Hetero]]></title><link><![CDATA[https://lovechip.en.ec21.com/VSMB1940ITX01-Infrared-Emitters--11979197_11979198.html]]></link><description><![CDATA[technology with high radiant power and high speed, molded in clear, untinted 0805 plastic package for surface mounting (SMD).
FEATURES
• Package type: surface mount
• Package form: 0805
• Dimen]]></description><pubDate><![CDATA[20240802]]></pubDate></item>
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<title><![CDATA[4 Way SMA Power Divider/Combiner 2-18GHz]]></title><link><![CDATA[https://xqymicrowave.en.ec21.com/4-Way-SMA-Power-Divider--11620030_11620033.html]]></link><description><![CDATA[technology
All XINQY power divider
,power splitter, combiner adopt advanced technology: precision CNC machining,SMT,eutectic sintering and hybrid microassembly.We have a variety of surface treatments]]></description><pubDate><![CDATA[20220812]]></pubDate></item>
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<title><![CDATA[Digital Isolators ISO7221AQDRQ1 Integrated Circuits Electronic Components Parts IC Chip]]></title><link><![CDATA[https://yingxinyuan01.en.ec21.com/Digital-Isolators-ISO7221AQDRQ1-Integrated-Circuits--11737095_11739689.html]]></link><description><![CDATA[Specifications
Manufacturer
Texas Instruments
Technology
Capacitive Coupling
Type
General Purpose
Isolated Power
No
Mounting Type
Surface Mount
Voltage - Supply
3V ~ 5.5V
Supplier Device Package
8-SO]]></description><pubDate><![CDATA[20230303]]></pubDate></item>
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<title><![CDATA[Flex PCB Assembly]]></title><link><![CDATA[https://fastlink2022.en.ec21.com/Flex-PCB-Assembly--11656157_11656158.html]]></link><description><![CDATA[surface mount technology (SMT) processes such as printing, placement, and reflow furnace procedures could not be completed.
Fastlink manufactures 1 –12 layer flex PCB, and also provides flex PCB as]]></description><pubDate><![CDATA[20221014]]></pubDate></item>
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<title><![CDATA[Quad Flat No-leads Package]]></title><link><![CDATA[https://oudenet.en.ec21.com/Quad-Flat-No-leads-Package--11792219_11792222.html]]></link><description><![CDATA[surface mount technology package used for integrated circuits (ICs). It is a variation of the Quad Flat Package (QFP) with the leads extending out from the sides of the package instead of from the bo]]></description><pubDate><![CDATA[20230518]]></pubDate></item>

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