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<title><![CDATA[EC21 Product Catalogs - cob modules]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/cob-modules--2673/1/cob modules.html]]></link><item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor-Plastic-Encapsulation-System--11840944_11840953.html]]></link><description><![CDATA[modules (MAX). Automatic loading and unloading module (option)
Features
1. Optimal for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression molding method]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

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