<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - mold for ceramic packages]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/mold-for-ceramic-packages--2673/1/mold for ceramic packages.html]]></link><item>
<title><![CDATA[Cartridge Heater with Fiberglass Wire, Swaged-in Mold Heating]]></title><link><![CDATA[https://polluxinte.en.ec21.com/Cartridge-Heater-with-Fiberglass-Wire--11391840_11957657.html]]></link><description><![CDATA[ceramic glue(we can do moistureproof design if it is in the wet environment) and make connecting wires with pure nickel (copper) which has high temperature resistant. The metal heating element can he]]></description><pubDate><![CDATA[20240626]]></pubDate></item>
<item>
<title><![CDATA[SEC-MP-5L Automatic Mixing and Pressing Machine]]></title><link><![CDATA[https://secondintelligent.en.ec21.com/SEC-MP-5L-Automatic-Mixing--11042501_11042512.html]]></link><description><![CDATA[mold adhesives, etc.), synthetic resin rubber , Ink, putty, abrasive (paste), wax products, synthetic rubber, synthetic resin, various powder materials, ceramic pigments;
4. Pharmaceutical products: ]]></description><pubDate><![CDATA[20240619]]></pubDate></item>
<item>
<title><![CDATA[Commutator Machinery]]></title><link><![CDATA[https://cosmosray.en.ec21.com/Commutator-Machinery--2894769_2894982.html]]></link><description><![CDATA[ceramic) products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic comp]]></description><pubDate><![CDATA[20240313]]></pubDate></item>
<item>
<title><![CDATA[Semiconductor Plastic Packaging Equipment / Photoelectric Semiconductor Packaging System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor-Plastic-Packaging-Equipment--11840944_11840952.html]]></link><description><![CDATA[for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression molding method
3. Optimal for high-volume production of LED packages
4. Modular concept to adapt ]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
<item>
<title><![CDATA[Water Pump]]></title><link><![CDATA[https://mfmachining.en.ec21.com/Water-Pump--10939669_10847050.html]]></link><description><![CDATA[mold is formed by using a wax pattern - a disposable piece in the shape of the desired part. The pattern is surrounded, or &quot;invested&quot;, into ceramic slurry that hardens into the mold. Investment casti]]></description><pubDate><![CDATA[20231012]]></pubDate></item>

</channel>
</rss>