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<title><![CDATA[EC21 Product Catalogs - semiconductor wafers]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor-wafers--2673/1/semiconductor wafers.html]]></link><item>
<title><![CDATA[9MB Electrode for Semiconductor Coating]]></title><link><![CDATA[https://reframetals.en.ec21.com/9MB-Electrode-for-Semiconductor-Coating--12016380_12041517.html]]></link><description><![CDATA[semiconductor wafer&apos;s surface to meet precise design requirements, which is crucial for manufacturing high-performance semiconductor devices.
The high electrical conductivity of the electrode provide]]></description><pubDate><![CDATA[20250206]]></pubDate></item>
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<title><![CDATA[AW-1008 Plasma Asher Semiconductor Process Equipment]]></title><link><![CDATA[https://allwin21.en.ec21.com/AW-1008-Plasma-Asher-Semiconductor--9763375_9763386.html]]></link><description><![CDATA[Manufacturer: Allwin21Condition: NewWafer Size: 3″ – 6″ CapabilityWafer Loading: 3-axis Robot wafer transfer (Video)Plasma Power: MicrowaveType: Parallel/Single Wafer Process; Stand-AloneGas Li]]></description><pubDate><![CDATA[20240514]]></pubDate></item>
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<title><![CDATA[Direct Drive Linear Motion Devices Torque Motor]]></title><link><![CDATA[https://cskhh.en.ec21.com/Direct-Drive-Linear-Motion-Devices--11859093_11907840.html]]></link><description><![CDATA[Semiconductor Manufacturing: Used in wafer handling and scanning applications.
Aerospace: Direct Drive Motors are utilized in motion control systems for aircraft control surfaces.
Medical Devices: In]]></description><pubDate><![CDATA[20240301]]></pubDate></item>
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<title><![CDATA[Auto]]></title><link><![CDATA[https://jueun.en.ec21.com/Auto--1678049_1678139.html]]></link><description><![CDATA[
-Automatic UV Tape hardening 
Possible to harden semiconductor wafer 
Simple product maintenance at low temperature 
CASSETE MEGAJINE TYPE 
High speed mass production 
Safety control system
]]></description><pubDate><![CDATA[20070215]]></pubDate></item>
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<title><![CDATA[Wafer Back Grinding Wheel]]></title><link><![CDATA[https://egrindwheel.en.ec21.com/Wafer-Back-Grinding-Wheel--11777670_11777688.html]]></link><description><![CDATA[wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back grinding wheel]]></description><pubDate><![CDATA[20230427]]></pubDate></item>
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<title><![CDATA[12-inch Wafer Cassettes]]></title><link><![CDATA[https://weibao2.en.ec21.com/12-inch-Wafer-Cassettes--10962927_10962944.html]]></link><description><![CDATA[12-inch wafer Cassettes are conventional 25 slot metal cassettes used in semiconductor manufacturing operations. They are typically used in areas where wafer positioning is important or where elevate]]></description><pubDate><![CDATA[20190531]]></pubDate></item>
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<title><![CDATA[OEM Single-crystal Silicon Parts,Semiconductor Silicon Rings,Silicon Targets, Silicon Slotted Rings]]></title><link><![CDATA[https://huanaifei.en.ec21.com/OEM-Single-crystal-Silicon-Parts--11859710_11859862.html]]></link><description><![CDATA[wafers (for research and development and for equipment testing and evaluation) and fabricated silicon products (routing, holing, cylinder fabrication).
Features
We stably supply high-quality single-c]]></description><pubDate><![CDATA[20231028]]></pubDate></item>

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