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<title><![CDATA[EC21 Product Catalogs - ball pin]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/ball_pin--10120399/1/ball pin.html]]></link><item>
<title><![CDATA[Medical Electronics Turnkey PCB Assembly]]></title><link><![CDATA[https://ucreatepcb123.en.ec21.com/Medical_Electronics_Turnkey_PCB_Assembly--11761239_11826376.html]]></link><description><![CDATA[pin space
0.3mm≤Pitch＜0.4mm
Min ball space
0.3mm≤Pitch＜0.5mm
PCB DIP Min thickness
T＜0.8mm
PCB DIP Max thickness
T＞2mm
PCB DIP Min Length
L≥50mm
PCB DIP Min Width
W≥30mm
PCB DIP Max L]]></description><pubDate><![CDATA[20230728]]></pubDate></item>
<item>
<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>

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