<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - bga ball]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/bga-ball--10120399/1/bga ball.html]]></link><item>
<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material-Handling-Equipment-Circuit-Board--10035716_10038624.html]]></link><description><![CDATA[BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
11, Materia]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Home Use Diesel Generator Printed Circuit Board Assemblies - Grande Electronics]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Home-Use-Diesel-Generator-Printed--4357166_4357168.html]]></link><description><![CDATA[BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, 
FR-1, 
94-V0 and so on.
11, Mater]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[DS-908 Tin Planting Station for Soldering Tool Set]]></title><link><![CDATA[https://17169962783.en.ec21.com/DS-908-Tin-Planting-Station--11981731_11981735.html]]></link><description><![CDATA[Description:DS-908 Macbook BGA Reball Platform, includes 3 GPUs, 8 CPUs, 2 PCHs, 3 SMCs, a type-c control chip, a RAM with video memory stencil, 2 BGA chip stenci, a touch bar with fingerprint contro]]></description><pubDate><![CDATA[20240807]]></pubDate></item>
<item>
<title><![CDATA[Semi-Auto Strapping Machine PCBA | Assembled Printed Circuit Boards]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Semi-Auto-Strapping-Machine-PCBA--11194245_11194246.html]]></link><description><![CDATA[BGA, Connectors BGA Ball Pitch=0.2mm 9, Each workstation in accordance with the SOP 10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on. 11, Material]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA-PCB-Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
<item>
<title><![CDATA[Industrial Control Equipment PCBA]]></title><link><![CDATA[https://hjl39506147520.en.ec21.com/Industrial-Control-Equipment-PCBA--11890882_11892786.html]]></link><description><![CDATA[PRODUCT DESCRIPTION
PCBA
Application
Industrial control equipment
CHIP Size
0402
QFN Spacing
0.4mm
QFN Spacing
0.4mm
BGA Ball Spacing
0.4mm
Package Type
Tape package, Tay tray package, Pipe package
]]></description><pubDate><![CDATA[20240124]]></pubDate></item>
<item>
<title><![CDATA[Red Soldermask Industry Control Electronics PCB Assembly]]></title><link><![CDATA[https://ucreatepcb123.en.ec21.com/Red-Soldermask-Industry-Control-Electronics--11761239_11786592.html]]></link><description><![CDATA[ball space
0.3mm≤Pitch＜0.5mm
PCB DIP Min thickness
T＜0.8mm
PCB DIP Max thickness
T＞2mm
PCB DIP Min Length
L≥50mm
PCB DIP Min Width
W≥30mm
PCB DIP Max Length
L≥1200mm
PCB DIP Max Width
W]]></description><pubDate><![CDATA[20230510]]></pubDate></item>

</channel>
</rss>