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<title><![CDATA[EC21 Product Catalogs - drilling line]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/drilling-line--10120399/1/drilling line.html]]></link><item>
<title><![CDATA[PCB - Flex]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB-Flex--12069932_12069955.html]]></link><description><![CDATA[Lines &amp; Spaces
• Standard: 75–100 μm
• Minimum: 50 μm (laser process/advanced specifications)
The finer the material, the greater the impact on cost and yield.
Layer Count
• 1~2 Layers (Sin]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Bespoke Motherboard Solutions From China OEM/ODM Electronics Mother Board Drone Equipment Circuit Bo]]></title><link><![CDATA[https://sncpcb.en.ec21.com/Bespoke-Motherboard-Solutions-From-China--11979593_11981106.html]]></link><description><![CDATA[drilled hole size 0.25mmMin.line width 0.10mm(4mil)Min.line spaceing 0.10mm(4mil)Surface finish/treatment HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold ]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[OEM PCBA Manufacturer Customize]]></title><link><![CDATA[https://idsystemkr.en.ec21.com/OEM-PCBA-Manufacturer-Customize--11944840_11944841.html]]></link><description><![CDATA[Laser Drill, Build-up
(4) High Quality Control System, Quick Delivery, Reasonable Price
(5) Prompt Feedback for inquiry
(6) In house production line
*image shown is an example of a display PCBA]]></description><pubDate><![CDATA[20240530]]></pubDate></item>
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<title><![CDATA[ODM Gold Finger PCB Board Fabrication High TG FR4 PCBA for Industrial Field]]></title><link><![CDATA[https://pcbboardfabrication.en.ec21.com/ODM-Gold-Finger-PCB-Board--11776872_11776873.html]]></link><description><![CDATA[drilled hole size0.25mmMin.line width0.075mm(3mil)Min.line spaceing0.075mm(3mil)Surface finish/treatmentElectroless/immersion gold/ENIG/Immersion silver/OSPCopper thickness0.5 oz - 8.0 ozSolder mask ]]></description><pubDate><![CDATA[20230426]]></pubDate></item>
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<title><![CDATA[FR4 Base LED PCB Circuit Board 1oz Copper 3/3MIL Min Line]]></title><link><![CDATA[https://electronicpcbboard.en.ec21.com/FR4-Base-LED-PCB-Circuit--11895685_11895686.html]]></link><description><![CDATA[Line width(mil)3mil4milMIN Line space(mil)3mil4milMin via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mmBoard thickness≤2.5mm0.2mm0.3mmBoard thickness＞2.5mmAspect Ration≤13:1Aspect Rat]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast-Supply-Electric-Circuit-Board--10919275_11050449.html]]></link><description><![CDATA[line distribution using micro-bumping. The HDI PCB assembly manufacturing
has an inner layer line and an outer layer line, and uses a process such as drilling and metallization in the hole to connect]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[DongGuan PCBA Factory Manufacturer SMT PCBA]]></title><link><![CDATA[https://pennydlo2015.en.ec21.com/DongGuan-PCBA-Factory-Manufacturer-SMT--11303710_11304595.html]]></link><description><![CDATA[FR4 Halogen Free, FR-1, FR-2, Aluminum 2. Board thickness:0.2mm-7mm 3. Max.finished board side:500mm*500mm 4. Min.drilled hole:0.25mm 5. Min.line width:0.075mm(3mil) 6. Copper thickness:0.5-4.0oz
]]></description><pubDate><![CDATA[20201205]]></pubDate></item>
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<title><![CDATA[Smart Electronics PCBA Prototype PCB Assembly Manufacturing Customized Printed Circuit Board]]></title><link><![CDATA[https://ruomeipcb02.en.ec21.com/Smart-Electronics-PCBA-Prototype-PCB--11819316_11819378.html]]></link><description><![CDATA[line width/gap 3.5/4mil(laser drill)Min. hole size 0.15mm(mechanical drill)/4mil(laser drill)Min. Annlar Ring 4milMax Copper thickness 6OZMin Solder Mask Bridge 0.08mmPlugging Vias capability 0.2-0.8]]></description><pubDate><![CDATA[20230713]]></pubDate></item>
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<title><![CDATA[Golden Triangle HDI PCB Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/Golden-Triangle-HDI-PCB-Capabilities--11805203_11836262.html]]></link><description><![CDATA[drilling to create the desired layout. Laser ablation is used to selectively remove copper from the board to create the desired pattern. Chemical etching is then used to create fine routing lines bet]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Half Hole &amp; Through Hole PCB]]></title><link><![CDATA[https://hhcircuits.en.ec21.com/Half-Hole-Through--11798970_11798971.html]]></link><description><![CDATA[drill, resulting in the lack of copper of the hole.
The size of the drill nozzle for drilling the half hole depends on the spacing of the contour lines.
Draw the solder mask film, use the gong space ]]></description><pubDate><![CDATA[20230530]]></pubDate></item>

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