<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - heating copper foil]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/heating-copper-foil--10120399/1/heating copper foil.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB-Hdi--12069932_12069957.html]]></link><description><![CDATA[High-Tg
Flex material
PI (Kapton)
Copper Foil
RA / ED, 0.5~1 oz
Line WIdth/Pitch
75~100 μm
Via
PTH / Blind / Micro
Protect
Solder Mask / Coverlay
Surface Finish
ENIG recommended
Test
BBT transfer
]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
<item>
<title><![CDATA[Aluminum Printed Circuit Board]]></title><link><![CDATA[https://pcbmain68.en.ec21.com/Aluminum-Printed-Circuit-Board--11046819_11248728.html]]></link><description><![CDATA[copper foil. The copper foil is etched into the desired circuit pattern and the metal base draws heat away from this circuit through the thin dielectric. 
Operating theory:
The power device surface m]]></description><pubDate><![CDATA[20240606]]></pubDate></item>
<item>
<title><![CDATA[Nano Carbon Copper Foil]]></title><link><![CDATA[https://filmtape.en.ec21.com/Nano-Carbon-Copper-Foil--11729864_11729876.html]]></link><description><![CDATA[Nano Carbon Copper Foil
Thermal conductivity [(W/(m.K)]≥680Thermal diffusivity (mm2/s)≥130Emissivity0.95Density (g/m3)7.6Specific heat (50°J/(kg.K)685HDT (℃)200Tensile strength(Mpa)≥295Adhes]]></description><pubDate><![CDATA[20230217]]></pubDate></item>

</channel>
</rss>