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<title><![CDATA[EC21 Product Catalogs - micro hole machining]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/micro-hole-machining--10120399/1/micro hole machining.html]]></link><item>
<title><![CDATA[Laser Engraving Cutting Machine Fast PCB Manufacturing &amp; Circuit Assembly]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Laser-Engraving-Cutting-Machine-Fast--4357166_4357342.html]]></link><description><![CDATA[Supplier: Grande Electronics
Layers: 4
PCB：FR-4/1.6mm, 1oz finished copper
Application: Laser Engraving Cutting Machine Fast PCB Manufacturing &amp; Circuit Assembly
Surface Treatment: ENIG
PCBA Lead t]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Rice-Milling-Machine-PCB-Assembly--11194245_11194269.html]]></link><description><![CDATA[Supplier: Shenzhen Grande Electronics
Layers: 4
PCB：FR-4/1.6mm, 1oz finished copper
Application: Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly
Surface Treatment: HASL
]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast-Supply-Electric-Circuit-Board--10919275_11050449.html]]></link><description><![CDATA[micro-bumping. The HDI PCB assembly manufacturing
has an inner layer line and an outer layer line, and uses a process such as drilling and metallization in the hole to connect the inside of each laye]]></description><pubDate><![CDATA[20231206]]></pubDate></item>

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