<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - chip modules]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_modules--1013/1/chip modules.html]]></link><item>
<title><![CDATA[STM32 Full Series MCU IC Chip Transistor Inverter Sensor Module Capacitor Resistor Fan Electronics]]></title><link><![CDATA[https://13728705391.en.ec21.com/STM32_Full_Series_MCU_IC--12033859_12033860.html]]></link><description><![CDATA[STM32全系列MCU For more electronic components, please send us your model number. We guarantee every chip is brand new and original!]]></description><pubDate><![CDATA[20241230]]></pubDate></item>
<item>
<title><![CDATA[Aluminum Silicon Carbide IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Aluminum_Silicon_Carbide_IGBT_Base--12057378_12057488.html]]></link><description><![CDATA[modules generate a large amount of heat during operation. The AlSiC material is usually used to fabricate the IGBT substrate, and the high-power IGBT module is firmly packaged, so that the chip can b]]></description><pubDate><![CDATA[20260522]]></pubDate></item>
<item>
<title><![CDATA[BareMetal]]></title><link><![CDATA[https://gosdwan.en.ec21.com/BareMetal--11805023_11805026.html]]></link><description><![CDATA[chips and forwarding network modules. It can be purchased on demand and on a pay-as-you-go basis according to business scenarios, meeting the demand for high availability and high control, while feat]]></description><pubDate><![CDATA[20230612]]></pubDate></item>
<item>
<title><![CDATA[LPC1788FBD144 Electronic Components]]></title><link><![CDATA[https://kinglionski.en.ec21.com/LPC1788FBD144_Electronic_Components--11640780_11640781.html]]></link><description><![CDATA[module supports real-time traceBoundary scan for simplified board testingNon-maskable Interrupt (NMI) input512 kB on-chip flash program memory96 kB on-chip SRAM4 kB on-chip EEPROMIn-System Programmin]]></description><pubDate><![CDATA[20220917]]></pubDate></item>
<item>
<title><![CDATA[Samsung Electro-Mechanics Distributor]]></title><link><![CDATA[https://aoewing.en.ec21.com/Samsung_Electro_Mechanics_Distributor--9591920_9592072.html]]></link><description><![CDATA[Chip Resistor，Crystal Devices，Filter，Inductor，MLCC，Tantalum，HDI，Package Substrate，FPCB（SMT），Rigid-Flex，Adapter，Antenna，Camera Module，Cellular FEM，Digital Tuner，LED L]]></description><pubDate><![CDATA[20150717]]></pubDate></item>
<item>
<title><![CDATA[Ops 2024]]></title><link><![CDATA[https://horion.en.ec21.com/Ops_2024--11891966_11891973.html]]></link><description><![CDATA[Industrial grade
High performance
Portable
Tailored accessory for interactive flat panel
Powerful chip
Mini-host based on Intel OPS standard x86 architecture; can work as a standard WINDOWS computer ]]></description><pubDate><![CDATA[20240122]]></pubDate></item>
<item>
<title><![CDATA[Rof Electrical Optical Modulator Y Waveguide Modulator LINBO3 Phase Modulation]]></title><link><![CDATA[https://rofer10.en.ec21.com/Rof_Electrical_Optical_Modulator_Y--11791377_11791378.html]]></link><description><![CDATA[modulation and other function. The waveguides and electrodes are fabricated on LiNbO3 chip, the output and input fibers are precisely coupled with the waveguides, then the whole chip is encapsulated ]]></description><pubDate><![CDATA[20230517]]></pubDate></item>
<item>
<title><![CDATA[Sell 6MBP300KA060,27907-34536,GS-R605S Power Modules IGBT]]></title><link><![CDATA[https://377704497.en.ec21.com/Sell_6MBP300KA060_27907_34536_GS--2989658_4100826.html]]></link><description><![CDATA[chips,ics,computer parts,laptop parts,electronic components,integrated circuits,transistors,diodes,IGBT,Modules,MCH, ICH,chip set,server chips,switch chips Best Wishes for your family and colleagues,]]></description><pubDate><![CDATA[20100203]]></pubDate></item>
<item>
<title><![CDATA[Cortex-A8 TINY2107 Inch Touch Screen, Android 4.0]]></title><link><![CDATA[https://tymall.en.ec21.com/Cortex_A8_TINY2107_Inch_Touch--4823045_7271190.html]]></link><description><![CDATA[Chip Block, support front-line precision touch support 3.5 &quot;-19&quot; full color TFT display SDIO interface: used to connect the SD WiFi module and other The CMOS Camera: used to connect CMOS camera RTC c]]></description><pubDate><![CDATA[20121107]]></pubDate></item>
<item>
<title><![CDATA[Flip Chip COF ILB Bonding Chip-on-Film Manufacturer]]></title><link><![CDATA[https://homraytech.en.ec21.com/Flip_Chip_COF_ILB_Bonding--9302647_9302653.html]]></link><description><![CDATA[Film, Chip-on-Flex, New COF design and COF ILB chip bonding and COF Package module. 
COF IC FOR LCD PC MODULE 
PI THICKNESS 38&amp;mu;m 
CU THICKNESS 8&amp;mu;m 
MIN PITCH: 35 &amp;mu;m 
FOR LG OR SAMSUNG]]></description><pubDate><![CDATA[20141203]]></pubDate></item>

</channel>
</rss>