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<title><![CDATA[EC21 Product Catalogs - high modulus]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/high_modulus--1013/1/high modulus.html]]></link><item>
<title><![CDATA[Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging &amp; Assembly Materials,Al-SiC,Al/SiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Heat_Sinks_Electronic_Packaging_Materials--12057378_12058546.html]]></link><description><![CDATA[Modulus
（GPa）
215±5
Bending Strength
（MPa）
380
Tensile Strength
（MPa）
270
Coefficient of Thermal Expansion
（10-6/K）
7.5±1
Thermal Conductivity
（W/m·K）
210±10
Product Features
]]></description><pubDate><![CDATA[20260702]]></pubDate></item>
<item>
<title><![CDATA[Drone Accessories Tethered Drone Power Station for Cleaning]]></title><link><![CDATA[https://rosefinchtech.en.ec21.com/Drone_Accessories_Tethered_Drone_Power--11840851_12004253.html]]></link><description><![CDATA[high-temperature resistant aviation wire, composite fluoroplastic insulation layer, high modulus tensile aviation grade fiber woven layerFiber optic
(optional)The tethered cable is an optoelectronic ]]></description><pubDate><![CDATA[20240913]]></pubDate></item>
<item>
<title><![CDATA[U-L Shape MOSI2 Heating Elements]]></title><link><![CDATA[https://jingshao345.en.ec21.com/U_L_Shape_MOSI2_Heating--11797690_11798604.html]]></link><description><![CDATA[high temperature.
Physical properties
Property
Value
Density (g.cm-3)
6.29
Melting Point (°C)
2230
Young’s Modulus (GPa)
430
Bend Strength (MPa)
250
Fracture Toughness K1C (MPa.m0.5)
3
Hardness (G]]></description><pubDate><![CDATA[20230627]]></pubDate></item>

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