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<title><![CDATA[EC21 Product Catalogs - package substrate]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/package_substrate--1013/1/package substrate.html]]></link><item>
<title><![CDATA[Aluminum Silicon Carbide IGBT Base Plate]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Aluminum_Silicon_Carbide_IGBT_Base--12057378_12057488.html]]></link><description><![CDATA[substrate, and the high-power IGBT module is firmly packaged, so that the chip can be used in vibration, high temperature and dust. The Aluminum Silicon Carbide IGBT Base Plate is very light, only ha]]></description><pubDate><![CDATA[20260623]]></pubDate></item>
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<title><![CDATA[Samsung Electro-Mechanics Distributor]]></title><link><![CDATA[https://aoewing.en.ec21.com/Samsung_Electro_Mechanics_Distributor--9591920_9592072.html]]></link><description><![CDATA[Package Substrate，FPCB（SMT），Rigid-Flex，Adapter，Antenna，Camera Module，Cellular FEM，Digital Tuner，LED Lighting Power，Media Storage，Server Power，TV Power，Vibration，Wireless]]></description><pubDate><![CDATA[20150717]]></pubDate></item>
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<title><![CDATA[S3C ARM11 Development Board 7inch, TINY6410 ARM Kit]]></title><link><![CDATA[https://tymall.en.ec21.com/S3C_ARM11_Development_Board_7inch--4823045_7271204.html]]></link><description><![CDATA[packages will have different LCD types, others are all the same ( 1) with a precision of touch, light adjustable ( 2) with a fine material ABS panel, easy disassembly ( 3 ) to provide LCD driver boar]]></description><pubDate><![CDATA[20121107]]></pubDate></item>
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<title><![CDATA[COF TAB IC Manufacturer for LCD Notebook Module]]></title><link><![CDATA[https://homraytech.en.ec21.com/COF_TAB_IC_Manufacturer_for--9302647_9302672.html]]></link><description><![CDATA[Substrate Film, Chip-on-Flex, New COF design and COF ILB chip bonding and COF Package module. 
COF IC FOR LCD TV MODULE 
PI THICKNESS 38&amp;mu;m 
CU THICKNESS 8&amp;mu;m 
MIN PITCH: 40 &amp;mu;m 
FOR LG OR SAMS]]></description><pubDate><![CDATA[20141203]]></pubDate></item>

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