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<title><![CDATA[EC21 Product Catalogs - bond conduction]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/bond_conduction--2673/1/bond conduction.html]]></link><item>
<title><![CDATA[Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Communication_Components_Precision_Structural_Components--12057378_12058299.html]]></link><description><![CDATA[Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to tradition]]></description><pubDate><![CDATA[20260512]]></pubDate></item>
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<title><![CDATA[Biomass Carbonization Furnace]]></title><link><![CDATA[https://bntet.en.ec21.com/Biomass_Carbonization_Furnace--12042309_12042327.html]]></link><description><![CDATA[bonds with minerals, microorganisms, organic matter, etc., thereby improving its adsorption capacity.High Stability&amp;Durability:The carbon in biochar exists mainly in aromatized and structured forms. ]]></description><pubDate><![CDATA[20250211]]></pubDate></item>
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<title><![CDATA[Plasma Gas Combustion Cathode]]></title><link><![CDATA[https://reframetals.en.ec21.com/Plasma_Gas_Combustion_Cathode--12016380_12041522.html]]></link><description><![CDATA[bond between the two alloys, resulting in an electrode with high strength and superior performance. The back-cast electrode structure is highly stable, allowing it to withstand the high-temperature a]]></description><pubDate><![CDATA[20250206]]></pubDate></item>
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<title><![CDATA[EPE Foam Sheet Bonding/Thickening Machine]]></title><link><![CDATA[https://moldingmachinetepai.en.ec21.com/EPE_Foam_Sheet_Bonding_Thickening--11547701_12021576.html]]></link><description><![CDATA[Bonding Machine
advantage
This machine is mainly used in thickening EPE Foam Sheet with air as medium of heat conducting, making use of high temperature air to melt EPE Foam Sheet each other, then pr]]></description><pubDate><![CDATA[20241031]]></pubDate></item>
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<title><![CDATA[Die-Cutting Machining]]></title><link><![CDATA[https://swsz88.en.ec21.com/Die_Cutting_Machining--7640366_11985033.html]]></link><description><![CDATA[conductivity, shielding, bonding fix, etc...
Product application:
Automotive instrumentation, electronics, electrical appliances, MP3, MP4, copiers, digital cameras, digital video cameras, laptops, m]]></description><pubDate><![CDATA[20240813]]></pubDate></item>
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<title><![CDATA[Semiconductor Gold Plating Machine]]></title><link><![CDATA[https://ruisite.en.ec21.com/Semiconductor_Gold_Plating_Machine--11829659_11979194.html]]></link><description><![CDATA[Gold plating has low contact resistance, good electrical conductivity, good weldability, corrosion resistance, so electroplating has a wide range of applications in integrated circuit manufacturing, ]]></description><pubDate><![CDATA[20240802]]></pubDate></item>
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<title><![CDATA[Tungsten Carbide Coated Roller]]></title><link><![CDATA[https://foshang05.en.ec21.com/Tungsten_Carbide_Coated_Roller--11962078_11962080.html]]></link><description><![CDATA[Tungsten carbide has the advantages of high melting point, high hardness, poor conductivity and thermal conductivity, and stable chemical performance. It is an ideal material for preparing wear-resis]]></description><pubDate><![CDATA[20240703]]></pubDate></item>
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<title><![CDATA[Herb Leaf Dryer,Tunnel Microwave Herb Drying Machine, Stevia Dryer,Thyme Dryer,Olive Leaf Dryer]]></title><link><![CDATA[https://sdyemai.en.ec21.com/Herb_Leaf_Dryer_Tunnel_Microwave--10746022_10747267.html]]></link><description><![CDATA[conduction and save a lot of drying time. Microwave sterilization temperature is from 70°C to 105°C, period is from 90 to 180 seconds. Microwave thermal effects change the bacterial protein, make i]]></description><pubDate><![CDATA[20240508]]></pubDate></item>
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<title><![CDATA[Velxun | Heated Platen Press | Hydraulic Press with Heating Platen]]></title><link><![CDATA[https://wb900508.en.ec21.com/Velxun_Heated_Platen_Press_Hydraulic--11927602_11927609.html]]></link><description><![CDATA[conducted on each unit before it leaves the factory to maintain the highest standards of quality control, which is a fundamental aspect of our manufacturing philosophy.
This versatile heated platen p]]></description><pubDate><![CDATA[20240421]]></pubDate></item>
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<title><![CDATA[Pcd Wire Drawing Dies]]></title><link><![CDATA[https://szwiredie.en.ec21.com/Pcd_Wire_Drawing_Dies--11921445_11922589.html]]></link><description><![CDATA[bonded together under high pressure and temperature.
PCD wire drawing dies offer several advantages over traditional dies made from materials like tungsten carbide or natural diamond. The composite s]]></description><pubDate><![CDATA[20240409]]></pubDate></item>
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<title><![CDATA[Metal Flue Gas Treatment System]]></title><link><![CDATA[https://sdngroups.en.ec21.com/Metal_Flue_Gas_Treatment_System--11906760_11906761.html]]></link><description><![CDATA[bond crystal has the advantages of both metal and ceramic materials, with excellent chemical stability, thermal stability, mechanical and physical properties, machinability, thermal conductivity and ]]></description><pubDate><![CDATA[20240227]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[conductor plastic packaging equipment usually includes the following parts:
Chip bonding: Paste the LED chip on the conductive support. The process requires high-precision equipment and techniques to]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Activated Carbon]]></title><link><![CDATA[https://jacarbon.en.ec21.com/Activated_Carbon--2379830_2387525.html]]></link><description><![CDATA[bonds.
Activated Carbon for Gas Phase (granule type) 
APPLICATIONS
SURFACE AREA (&amp;#13217;/g)
C6H6(%)
BENZENE NO.
(MESH)
PORE
VOLUME (cc/g)
AIR PURIFICATION, ODOR REMOVAL, GAS MASK
900~1200
25~35
2 x ]]></description><pubDate><![CDATA[20121221]]></pubDate></item>

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