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<title><![CDATA[EC21 Product Catalogs - broken wafers]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/broken_wafers--2673/1/broken wafers.html]]></link><item>
<title><![CDATA[Dicing Blades with Hub]]></title><link><![CDATA[https://egrindwheel.en.ec21.com/Dicing_Blades_with_Hub--11777670_11777680.html]]></link><description><![CDATA[broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.
Specifications of Di]]></description><pubDate><![CDATA[20230427]]></pubDate></item>
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<title><![CDATA[Wafer Pre Aligner]]></title><link><![CDATA[https://semiust.en.ec21.com/Wafer_Pre_Aligner--7745219_7745220.html]]></link><description><![CDATA[Wafer Edge Crack and Broken Detect 
- 2inch ~ 12inch Simultaneous use (CCD Stage Moving Type) 
- Poor Coating and Cracked wafer support alignment 
- Crack Point&apos;s degree and quantity information outp]]></description><pubDate><![CDATA[20130319]]></pubDate></item>

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