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<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - chip array]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_array--2673/1/chip array.html]]></link><item>
<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11910388_11910390.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20240311]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[array of high-power diode, high-power light emitting diode (LED), radio frequency power transistor, high-power &amp; high-frequency electronic (optoelectronic) devices, the cooling fin of multichip modul]]></description><pubDate><![CDATA[20230511]]></pubDate></item>

</channel>
</rss>