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<title><![CDATA[EC21 Product Catalogs - chip arrays]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_arrays--2673/1/chip arrays.html]]></link><item>
<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11910388_11910390.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20240311]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[chip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.
]]></description><pubDate><![CDATA[20230511]]></pubDate></item>

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