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<title><![CDATA[EC21 Product Catalogs - chip packaging]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_packaging--2673/1/chip packaging.html]]></link><item>
<title><![CDATA[Larch Wood Sawdust Pellet Making Mahcine/Mill]]></title><link><![CDATA[https://jasonpelletmachine.en.ec21.com/Larch_Wood_Sawdust_Pellet_Making--12030022_12030181.html]]></link><description><![CDATA[chips are produced through processes such as crushing, drying, screening, granulation, cooling, and packaging. Its finished products are used in biomass power generation, boilers, fireplaces, househo]]></description><pubDate><![CDATA[20241209]]></pubDate></item>
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<title><![CDATA[Input Output Controller KUC720AE101 3BHB003431R0101 3BHB000652R0101]]></title><link><![CDATA[https://wwww666666.en.ec21.com/Input_Output_Controller_KUC720AE101_3BHB003431R0101--11939088_11947899.html]]></link><description><![CDATA[chip bus error handling provides features. Provide latches 　　and registers to allow SBC to read causing bus errors in all modes. The Universal chip supports limited decoupling modes. Provides sup]]></description><pubDate><![CDATA[20240605]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[packaging equipment.
LED semiconductor plastic packaging equipment is used to package LED chips into LED lamp beads. LED chips are usually made of semiconductor materials, while LED lamp beads need t]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Slanting Facing and Centering Machine SZ820530/SZ820550]]></title><link><![CDATA[https://lecn.en.ec21.com/Slanting_Facing_and_Centering_Machine--11588381_11588382.html]]></link><description><![CDATA[package of all kinds of slender, irregular and stepped parts. High coaxiality, high efficiency, chip easily, it can carry with truss or joint robot and automatical line. 
Technical Parameters
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SZ]]></description><pubDate><![CDATA[20231106]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11910388_11910390.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20240311]]></pubDate></item>
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<title><![CDATA[ESD Black Leader Tape]]></title><link><![CDATA[https://linh123.en.ec21.com/ESD_Black_Leader_Tape--7688678_9404622.html]]></link><description><![CDATA[The company IC chip frame substrate independent research and development of the guide, high precision, good appearance, low price, the products have been sold to the world more than IC manufacturing ]]></description><pubDate><![CDATA[20230801]]></pubDate></item>
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<title><![CDATA[Chromatography WorkStation]]></title><link><![CDATA[https://sthzi.en.ec21.com/Chromatography_WorkStation--7001701_7001702.html]]></link><description><![CDATA[Packaging &amp; Delivery
Packaging Details: TNT, UPS, FedEx available. Or per your requirements.
Delivery Detail: 7 days by air
Payment: PREPAID 100% in advance
Item Description
N2000 Chromatogram Data S]]></description><pubDate><![CDATA[20171128]]></pubDate></item>
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<title><![CDATA[LED Bulb Automatic Assembly Machine]]></title><link><![CDATA[https://rongyumachine.en.ec21.com/LED_Bulb_Automatic_Assembly_Machine--10519041_10519042.html]]></link><description><![CDATA[chip)-Press the LED chip-Automatic welding(Two solid wire)-Automatic bend the side line--Semi-finished product delivery.
◆This High-speed multi-functional fully automatic rotary type LED bulb light]]></description><pubDate><![CDATA[20231101]]></pubDate></item>
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<title><![CDATA[CNC Machine Tool PD-ST Medium-Speed Wire-Moving Control System]]></title><link><![CDATA[https://wjcncmachine.en.ec21.com/CNC_Machine_Tool_PD_ST--10984002_11028623.html]]></link><description><![CDATA[Packaging outline size (L*W*H)
1720×1300×1800mm
1850×1420×1800mm
2050×1600×1900mm
2340×2100×2160mm
visit our website:
https://www.wjcncmachine.com/medium-speed-wire-cutting-machine/
More info]]></description><pubDate><![CDATA[20240322]]></pubDate></item>
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<title><![CDATA[Honeycomb Cutter]]></title><link><![CDATA[https://sanmachinery2021.en.ec21.com/Honeycomb_Cutter--11865862_11865873.html]]></link><description><![CDATA[packaging.
Honeycomb Cutter Series
Honeycomb Paper Core Expander
This paper core expander machine is applied to expand and dry the honeycomb paper core. By heating and drying, evaporating the water i]]></description><pubDate><![CDATA[20231113]]></pubDate></item>
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<title><![CDATA[NB200/200pfc/250pfc/350/500]]></title><link><![CDATA[https://cindydun27.en.ec21.com/NB200_200pfc_250pfc_350_500--11924852_11925061.html]]></link><description><![CDATA[chip design,ensure the duty cycle5.32-bit microcomputer chip processor,real-time current display6.Advanced high-efficiency inverter technology,30khz,high working frequency7.Usable for generator, suit]]></description><pubDate><![CDATA[20240415]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[chip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.
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<title><![CDATA[PLC Control IC Chip Molding Machine]]></title><link><![CDATA[https://semiconductormolding.en.ec21.com/PLC_Control_IC_Chip_Molding--11895700_11895701.html]]></link><description><![CDATA[Packaging Details: Wooden PackagingDelivery Time: 40 daysPayment Terms: TTProduct Attributes:Auto Transfer MoldingAuto Packaging EquipmentAuto Packaging EquipmentInjection Unit: SingleMax. Mold Heigh]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[SCM3000 M2M Chip Personalization Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/SCM3000_M2M_Chip_Personalization_Machine--11883003_11883028.html]]></link><description><![CDATA[The M2M Chip Personalization Machine SCM3000
can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, automoti]]></description><pubDate><![CDATA[20240103]]></pubDate></item>

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