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<title><![CDATA[EC21 Product Catalogs - crack ic]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/crack_ic--2673/1/crack ic.html]]></link><item>
<title><![CDATA[Ultra Low Humidity Dry Cabinet for MSD IPC/JEDEC J-STD-033]]></title><link><![CDATA[https://eurekamarketing.en.ec21.com/Ultra_Low_Humidity_Dry_Cabinet--9213141_9213204.html]]></link><description><![CDATA[cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components. 
Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB wh]]></description><pubDate><![CDATA[20181025]]></pubDate></item>

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