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<title><![CDATA[EC21 Product Catalogs - crystal injections]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/crystal_injections--2673/1/crystal injections.html]]></link><item>
<title><![CDATA[Metal Flue Gas Treatment System]]></title><link><![CDATA[https://sdngroups.en.ec21.com/Metal_Flue_Gas_Treatment_System--11906760_11906761.html]]></link><description><![CDATA[crystal has the advantages of both metal and ceramic materials, with excellent chemical stability, thermal stability, mechanical and physical properties, machinability, thermal conductivity and elect]]></description><pubDate><![CDATA[20240227]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[The company&apos;s main business scope:1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Photovoltaic Module Slicing Machine High Speed Non-destructive Machine CTC-30-BC]]></title><link><![CDATA[https://zbqtcdz01.en.ec21.com/Photovoltaic_Module_Slicing_Machine_High--11819918_11878054.html]]></link><description><![CDATA[crystallization/efficient mass production/more power generation
Fragment rate：0.1% Maximum operating speed of the equipment：800mm/s Positioning deviation:≤± 0.1mm Mode：Laser cutting
Laser wa]]></description><pubDate><![CDATA[20231220]]></pubDate></item>

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