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<title><![CDATA[EC21 Product Catalogs - etching processing]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/etching_processing--2673/1/etching processing.html]]></link><item>
<title><![CDATA[Silicone Heating Pad]]></title><link><![CDATA[https://honeywon.en.ec21.com/Silicone_Heating_Pad--4537099_4552353.html]]></link><description><![CDATA[Silicon Rubber Heaters have wire-wound or etched foil heating elements protected by
fiberglass-reinforced silicon rubber vulcanized and compressed at high temperature and
press. They are thin, bendab]]></description><pubDate><![CDATA[20250320]]></pubDate></item>
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<title><![CDATA[Selective Etching]]></title><link><![CDATA[https://walthysales320.en.ec21.com/Selective_Etching--10655283_10655621.html]]></link><description><![CDATA[Selective etching is a process that removing required layer and no hurt to any other layer, usually the removed layer should be at the top side, but in some situation, we could also remove the inside]]></description><pubDate><![CDATA[20250202]]></pubDate></item>
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<title><![CDATA[Atmospheric Plasma Cleaning System Chain Conveyor]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Atmospheric_Plasma_Cleaning_System_Chain--11960396_11963494.html]]></link><description><![CDATA[processing to solve problems such as plugging holes, bursting holes, and peeling.
Principles of Plasma Cleaning
1. Etching on the Material Surface - Physical Effect
The large number of ions, excited ]]></description><pubDate><![CDATA[20240705]]></pubDate></item>
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<title><![CDATA[Wafer Vacuum Transfer Platform]]></title><link><![CDATA[https://qztqzt.en.ec21.com/Wafer_Vacuum_Transfer_Platform--11907826_11907830.html]]></link><description><![CDATA[Wafer Vacuum Transfer Module (VTM)
The Vacuum Transfer Module (VTM) is used in vacuum processes such as wafer etching, deposition (CVD, PVD, ALD), etc. Due to the stringent requirements of the proces]]></description><pubDate><![CDATA[20240531]]></pubDate></item>
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<title><![CDATA[AccuSputter AW 4450 Sputter Deposition System]]></title><link><![CDATA[https://allwin21.en.ec21.com/AccuSputter_AW_4450_Sputter_Deposition--9763374_9763384.html]]></link><description><![CDATA[Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, P]]></description><pubDate><![CDATA[20240514]]></pubDate></item>
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<title><![CDATA[Semiconductor Scrubber]]></title><link><![CDATA[https://bdc77.en.ec21.com/Semiconductor_Scrubber--11837922_11837924.html]]></link><description><![CDATA[processing efficiency of PFC GAS
MODEL
DBC-BECO
Gas Process
Plasma Arc
Total Capacity
300slm for CVD
Dimension
800(W) x 800(D) x 1850(H)
Power Consumption
11 Kw for CF4 DRE 90%
8 Kw for NF3 DRE 95%
T]]></description><pubDate><![CDATA[20231231]]></pubDate></item>
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<title><![CDATA[12-inch Wafer Cassettes]]></title><link><![CDATA[https://weibao2.en.ec21.com/12_inch_Wafer_Cassettes--10962927_10962944.html]]></link><description><![CDATA[systems, photo resist bake systems, and robotic loading systems for CVD and etch processes. This series has been incorporated as the original equipment carrier provided by similar OEM’s.
]]></description><pubDate><![CDATA[20190531]]></pubDate></item>
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<title><![CDATA[OEM Single-crystal Silicon Parts,Semiconductor Silicon Rings,Silicon Targets, Silicon Slotted Rings]]></title><link><![CDATA[https://huanaifei.en.ec21.com/OEM_Single_crystal_Silicon_Parts--11859710_11859862.html]]></link><description><![CDATA[processing, including double-sided polishing, double-sided etching, and double-sided lapping.
3.We can manufacture wafers in thicknesses from 100 µm (4 inches) to 2000 µm.
Silicon wafers for sensor]]></description><pubDate><![CDATA[20231028]]></pubDate></item>
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<title><![CDATA[Custom Precision CNC Lathe Machine Parts Aluminum Brass Material]]></title><link><![CDATA[https://lathecncmachining.en.ec21.com/Custom_Precision_CNC_Lathe_Machine--11859491_11859492.html]]></link><description><![CDATA[process of production involves CNC machining, surface treatment and 3/4/5 axis center machining.
The CNC Lathe Machine Parts are commonly produced with milling, turning, drilling, broaching, etching/]]></description><pubDate><![CDATA[20231027]]></pubDate></item>
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<title><![CDATA[Chemical Etching Kovar and Etching Kovar Alloys]]></title><link><![CDATA[https://wetetching.en.ec21.com/Chemical_Etching_Kovar_and_Etching--11869908_11869923.html]]></link><description><![CDATA[ProcessingEach Kovar alloy possesses distinct advantages and disadvantages in wet processing and etching:
ASTM F-15 Kovar: Advantages: Low coefficient of thermal expansion, ideal for glass-to-metal s]]></description><pubDate><![CDATA[20231124]]></pubDate></item>
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<title><![CDATA[CNC Machining Copper]]></title><link><![CDATA[https://flourishlegend.en.ec21.com/CNC_Machining_Copper--11858161_11858170.html]]></link><description><![CDATA[etching: Acid etching is a process that removes oxide layers and impurities from the copper surface. By immersing the copper part in an acidic solution, oxide compounds, and impurities can be removed]]></description><pubDate><![CDATA[20231024]]></pubDate></item>
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<title><![CDATA[Anodized CNC Machining Mechanical Parts Titanium Parts]]></title><link><![CDATA[https://szxhcnc.en.ec21.com/Anodized_CNC_Machining_Mechanical_Parts--11778367_11778368.html]]></link><description><![CDATA[Etching / Chemical Machining, Laser Machining, Milling, Other Machining Services, Turning, Wire EDM, Rapid Prototyping
Materials
Aluminum, Brass, Bronze, Copper, Hardened Metals, Precious Metals, Sta]]></description><pubDate><![CDATA[20230428]]></pubDate></item>
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<title><![CDATA[CNC Machining Parts OEM Custom Metal Milling Turning Service Aluminum Industrial]]></title><link><![CDATA[https://vnpma.en.ec21.com/CNC_Machining_Parts_OEM_Custom--11847214_11848270.html]]></link><description><![CDATA[Overview Quick Details CNC Machining or Not: CNC Machining Type: Broaching, DRILLING, Etching / Chemical Machining, Laser Machining, Milling, Other Machining Services, Turning, Wire EDM Material Capa]]></description><pubDate><![CDATA[20230926]]></pubDate></item>
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<title><![CDATA[PCB Developing Machine]]></title><link><![CDATA[https://ruisite.en.ec21.com/PCB_Developing_Machine--11829659_11829665.html]]></link><description><![CDATA[etching uniformity C.O.V ≥ 96%, etching factor ≥ 5.
4. Cone roller type membrane slag separation system, can be efficient and clean collection and processing of membrane slag. Equipment outside d]]></description><pubDate><![CDATA[20230804]]></pubDate></item>
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<title><![CDATA[Underwater Robot Rapid Prototype Manufacturer]]></title><link><![CDATA[https://sgada123.en.ec21.com/Underwater_Robot_Rapid_Prototype_Manufacturer--10670858_10671769.html]]></link><description><![CDATA[Prototype Description: 
Item name
Underwater Robot Rapid Prototype Manufacturer
Material
ABS,PC,PMMA,POM,PETF,PA ,Aluminum,Brass,Stainess steel,Sheet metal,etc.
Processing way
CNC Machining
Tolerance]]></description><pubDate><![CDATA[20180302]]></pubDate></item>

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