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<title><![CDATA[EC21 Product Catalogs - high stability cob chip]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/high_stability_cob_chip--2673/1/high stability cob chip.html]]></link><item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[stability of the plastic package.
Cutting: Cut the plastic package into individual LED lamp beads. This process requires high-precision equipment and technology to ensure the consistent size and shap]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

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