<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - host module]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/host_module--2673/1/host module.html]]></link><item>
<title><![CDATA[Aluminum Melting Furnace]]></title><link><![CDATA[https://osneq.en.ec21.com/Aluminum_Melting_Furnace--12017287_12017291.html]]></link><description><![CDATA[modules, which have good thermal insulation effect and the temperature of the furnace shell does not exceed 45 degrees.
Product parameters
model
Power( Kw )
Melting capacity ( kg/h )
Product Size(L *]]></description><pubDate><![CDATA[20241014]]></pubDate></item>
<item>
<title><![CDATA[QFP Package Lead Frame Precision High-speed Stamping Production Line]]></title><link><![CDATA[https://oreku.en.ec21.com/QFP_Package_Lead_Frame_Precision--11941325_11951019.html]]></link><description><![CDATA[QFP Package Lead Frame Precision High-speed Stamping Production Line
Model: OKU-65HK
Speed: 700 times/min
Tonnage: 65 tons
Travel: 30mm
1. Electric mold height adjustment
2. Module height display acc]]></description><pubDate><![CDATA[20240613]]></pubDate></item>
<item>
<title><![CDATA[Main Control Board 500CIM05 1MRB150077R1/B]]></title><link><![CDATA[https://wwww666666.en.ec21.com/Main_Control_Board_500CIM05_1MRB150077R1--11939088_11948444.html]]></link><description><![CDATA[modules. VMEbus system can easily add up to 2 PMC modules to VMEbus system. All PMC I/O signals are routed to VMEbus 　　connector P2 according to IEEE P1386/Draft 2.0 specification, Suitable for t]]></description><pubDate><![CDATA[20240612]]></pubDate></item>
<item>
<title><![CDATA[Check Scanning Module (PCSU)]]></title><link><![CDATA[https://puloon1.en.ec21.com/Check_Scanning_Module_PCSU--49051_2945566.html]]></link><description><![CDATA[PCSU is a check scanning module with MICR and Endorsing Printer. It could be used in check cashing kiosk or check payment terminal. It send the image and information from check to the host after read]]></description><pubDate><![CDATA[20080729]]></pubDate></item>
<item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[host + 5 modules (MAX). Automatic loading and unloading module (option)
Features
1. Optimal for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression moldi]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

</channel>
</rss>