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<title><![CDATA[EC21 Product Catalogs - ic packaging]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/ic_packaging--2673/1/ic packaging.html]]></link><item>
<title><![CDATA[Allen-Bradley 22-HIM-A3 Drive HIM Module Pn 37834]]></title><link><![CDATA[https://cwgreentech.en.ec21.com/Allen_Bradley_22_HIM_A3--11988935_11988948.html]]></link><description><![CDATA[IC-TD002
Provides a quick reference tool for Allen-Bradley industrial automation controls and
assemblies.
Safety Guidelines for the Application, Installation, and Maintenance of Solid-state
Control, ]]></description><pubDate><![CDATA[20240821]]></pubDate></item>
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<title><![CDATA[Semiconductor Gold Plating Machine]]></title><link><![CDATA[https://ruisite.en.ec21.com/Semiconductor_Gold_Plating_Machine--11829659_11979194.html]]></link><description><![CDATA[IC package commonly used electroplated gold bump; in CMOS/MEMS in the application of electroplating to make switch contacts and various structures, etc.; In the radar gold plating as an air bridge is]]></description><pubDate><![CDATA[20240802]]></pubDate></item>
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<title><![CDATA[Radio-Frequency Plasma System AS-V100]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Radio_Frequency_Plasma_System_AS--11960396_11960409.html]]></link><description><![CDATA[packaging, medical device processing, and automotive decoration cleaning.
The AS-V100 plasma system is designed based on years of close collaboration with PCB manufacturing plants and users from othe]]></description><pubDate><![CDATA[20240701]]></pubDate></item>
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<title><![CDATA[Preform Pre-Heater]]></title><link><![CDATA[https://cosmosray.en.ec21.com/Preform_Pre_Heater--2894769_2894974.html]]></link><description><![CDATA[The H. F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, melamine tablewares, and packaging of IC, transistors and other micro-]]></description><pubDate><![CDATA[20240313]]></pubDate></item>
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<title><![CDATA[Ultra Low Humidity Dry Cabinet for MSD IPC/JEDEC J-STD-033]]></title><link><![CDATA[https://eurekamarketing.en.ec21.com/Ultra_Low_Humidity_Dry_Cabinet--9213141_9213204.html]]></link><description><![CDATA[IC packages such as:
Dual-in-line: flatpack, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, DFN
Quad-in-line: PLCC, QFP, LQFP, PQFP, CQFP, MQFP, TQFP, QFN, LCC, MLP, PQFN
Grid arrays: PGA, BGA, LGA, FBGA,]]></description><pubDate><![CDATA[20181025]]></pubDate></item>
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<title><![CDATA[SCM3000 M2M Chip Personalization Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/SCM3000_M2M_Chip_Personalization_Machine--11883003_11883028.html]]></link><description><![CDATA[The M2M Chip Personalization Machine SCM3000
can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, automoti]]></description><pubDate><![CDATA[20240103]]></pubDate></item>
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<title><![CDATA[Hydrogen Oxygen Hho Brown Gas Generator Acrylic Polishing Machine]]></title><link><![CDATA[https://smtlabtech.en.ec21.com/Hydrogen_Oxygen_Hho_Brown_Gas--11797359_11797374.html]]></link><description><![CDATA[IC packaging.
4.Polishing: Organic glass/Acrylic PolishOur AdvantagesCost saving 
Oxy hydrogen Generator saves 60% cost compared to acetylene. Saves 40% compared to propane. The fuel is just pure wat]]></description><pubDate><![CDATA[20230526]]></pubDate></item>
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<title><![CDATA[Omron H7EC-NV Digital Total Counter Brand New]]></title><link><![CDATA[https://linture.en.ec21.com/Omron_H7EC_NV_Digital_Total--11851699_11856060.html]]></link><description><![CDATA[Packaging and Handling:
Items are safely packaged in custom shipping cartons for protection.
Shipping:
We ship worldwide use UPS,FedEx, DHL or Truck Freight when meeded.
Call to use a shipping servic]]></description><pubDate><![CDATA[20231018]]></pubDate></item>
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<title><![CDATA[Product of Extrude]]></title><link><![CDATA[https://chengsong.en.ec21.com/Product_of_Extrude--1_3196060.html]]></link><description><![CDATA[precision, credibility and special detailed products and our optimal system extrusion process that produces semiconductor, IC and other element packaging tube cases will meet the customer&apos;s demand.
]]></description><pubDate><![CDATA[20010625]]></pubDate></item>
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<title><![CDATA[Semi-automatic Nailing Machine]]></title><link><![CDATA[https://weibao2.en.ec21.com/Semi_automatic_Nailing_Machine--10962991_10963010.html]]></link><description><![CDATA[IC into the antistatic plastic pipe for storage, and the IC of the filling tube needs to be sealed so that IC will not fall out. At present, many semiconductor packaging and testing enterprises adopt]]></description><pubDate><![CDATA[20190531]]></pubDate></item>
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<title><![CDATA[NOVA New and Original IC BUF NON-INVERT 5.5V SOT23-5 SN74LVC1G125DBVR]]></title><link><![CDATA[https://hknovatech.en.ec21.com/NOVA_New_and_Original_IC--11889683_11890202.html]]></link><description><![CDATA[JXSQ New and Original IC BUF NON-INVERT 5.5V SOT23-5 SN74LVC1G125DBVRTYPEDESCRIPTIONSELECTCategoryIntegrated Circuits (ICs)LogicBuffers, Drivers, Receivers, Transceivers Series74LVC PackageTape &amp; Ree]]></description><pubDate><![CDATA[20240118]]></pubDate></item>
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<title><![CDATA[Baking Dry Cabinet]]></title><link><![CDATA[https://raingoal.en.ec21.com/Baking_Dry_Cabinet--9489546_5421362.html]]></link><description><![CDATA[packages to comply with IPC/JEDEC J-STD-033C. 
Features
Advanced ultra-low humidity technology, effective thermal insulation to make the energy consumption the lowest.
Dry units: 2%~50%RH.
Heater: Ro]]></description><pubDate><![CDATA[20150428]]></pubDate></item>
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<title><![CDATA[Polyimide Varnish]]></title><link><![CDATA[https://picomax.en.ec21.com/Polyimide_Varnish--7187856_7187933.html]]></link><description><![CDATA[resistance
Application
Electronic material : FCCL, Covering materials, Package PCB
Semiconductor materials : Buffer coat, LSI, Passivation
Optics cable, Vacuum equipment, IC test socket, etc.
]]></description><pubDate><![CDATA[20121231]]></pubDate></item>

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