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<title><![CDATA[EC21 Product Catalogs - integrated circuits chips]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/integrated_circuits_chips--2673/1/integrated circuits chips.html]]></link><item>
<title><![CDATA[NOVA TPS51117RGYR 14-VQFN Original Electronic Components Integrated Circuit IC Chip Bom SMT PCBA]]></title><link><![CDATA[https://hknovatech.en.ec21.com/NOVA_TPS51117RGYR_14_VQFN_Original--11889683_11889778.html]]></link><description><![CDATA[Integrated Circuits (ICs)Power Management (PMIC)DC DC Switching Controllers PackageTape &amp; Reel (TR)Cut Tape (CT)Digi-Reel® Product StatusActive Output TypeTransistor Driver FunctionStep-Down Output ]]></description><pubDate><![CDATA[20240117]]></pubDate></item>
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<title><![CDATA[HWN-86A FEP Corrugated Tube Kubota Sleeves Cutting Machine]]></title><link><![CDATA[https://yueyeuniao1112.en.ec21.com/HWN_86A_FEP_Corrugated_Tube--10737675_10737313.html]]></link><description><![CDATA[circuit adopts high-precision single chip integrated
control, simple operation and stable control. The screen adopts touch-screen
color screen to display all kinds of data at a glance.
Technical Para]]></description><pubDate><![CDATA[20240915]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11910388_11910390.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20240311]]></pubDate></item>
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<title><![CDATA[A+Z  B+Z  Series]]></title><link><![CDATA[https://tjfreya.en.ec21.com/A_Z_B_Z_Series--9613790_9614006.html]]></link><description><![CDATA[integrated product
This product output corner pint pointing ,the overall proportional control the amplifier ,the position transmission function concentrates in together ,Realizes the true integration]]></description><pubDate><![CDATA[20150731]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[chip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.
]]></description><pubDate><![CDATA[20230511]]></pubDate></item>

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