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<title><![CDATA[EC21 Product Catalogs - kns]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/kns--2673/1/kns.html]]></link><item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[KNS, Kaijo and other mainstream packaging equipment.Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are essential]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

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