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<title><![CDATA[EC21 Product Catalogs - led assembling machine]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/led_assembling_machine--2673/1/led assembling machine.html]]></link><item>
<title><![CDATA[LED Bulb Full Automatic Assembly Machine]]></title><link><![CDATA[https://rongyumachine.en.ec21.com/LED_Bulb_Full_Automatic_Assembly--10519041_10596917.html]]></link><description><![CDATA[LED bulb light assembly line adopts PLC control. Photoelectric monitoring various parts of the movement, If there is an abnormal in the operation, the machine can automatically stop and display the r]]></description><pubDate><![CDATA[20180821]]></pubDate></item>
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<title><![CDATA[Atmospheric Plasma Cleaning System Chain Conveyor]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Atmospheric_Plasma_Cleaning_System_Chain--11960396_11963494.html]]></link><description><![CDATA[machine itself is a very environmentally friendly equipment, which does not produce any pollution, and the treatment process does not produce any pollution.
It can be matched with the original produc]]></description><pubDate><![CDATA[20240705]]></pubDate></item>
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<title><![CDATA[LED Insert Molding Precision High-speed Punch Hardware Electronic Processing Equipment]]></title><link><![CDATA[https://oreku.en.ec21.com/LED_Insert_Molding_Precision_High--11941325_11951137.html]]></link><description><![CDATA[LED Insert Molding Precision High-speed Punch Hardware Electronic Processing Equipment
What are the structural characteristics of the continuous die used in high-speed punching machines?
Compared wit]]></description><pubDate><![CDATA[20240613]]></pubDate></item>
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<title><![CDATA[Hepa Filter PU Dosing Gluing Machine]]></title><link><![CDATA[https://xd5358840.en.ec21.com/Hepa_Filter_PU_Dosing_Gluing--6307152_10814791.html]]></link><description><![CDATA[220V 50Hz/60Hz
Power requirement
3.55KW
Air pressure requirement
4.5-8KG
Machine Dimension
1500(L)*1200(W)*1500(H)mm
Weight
approx 260 KG
Work environment
Humidity: 20%~98%RH; Temperature: 0~+40°c
]]></description><pubDate><![CDATA[20240530]]></pubDate></item>
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<title><![CDATA[Semiconductor Molding Equipment Fou Display LED Plastic Package]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Molding_Equipment_Fou_Display--11840944_11840945.html]]></link><description><![CDATA[assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated machine, photoelectric automatic eutectic machine eutectic f]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Tel Act 8, 12 / Tel Mark Overhaul]]></title><link><![CDATA[https://semiust.en.ec21.com/Tel_Act_8_12_Tel--7745219_7745236.html]]></link><description><![CDATA[TEL ACT-8,12 Machine&amp;rsquo;s Inch Conversion (2,4,6,8 inch)
- 6inch and 8inch Multi Flow 
- Cassette Unit and Robot Modification 
- Mapping Sensor Block Modification 
- Main Robot Arm Modification 
-]]></description><pubDate><![CDATA[20140102]]></pubDate></item>

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