<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - led assembling]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/led_assembling--2673/1/led assembling.html]]></link><item>
<title><![CDATA[LED Bulb Automatic Assembly Line Machine]]></title><link><![CDATA[https://rongyumachine.en.ec21.com/LED_Bulb_Automatic_Assembly_Line--10519041_10594735.html]]></link><description><![CDATA[LED bulb assembly line equipment machines 
[Including LED chip-welding Assembly Machine And LED lamp base-pc cover Assembly Machine] 
Summarize: 
Do you know how to assembly the LED bulbs from raw ma]]></description><pubDate><![CDATA[20180821]]></pubDate></item>
<item>
<title><![CDATA[Gel Stick]]></title><link><![CDATA[https://mecindustries.en.ec21.com/Gel_Stick--4274004_11922292.html]]></link><description><![CDATA[assembly lines
ㆍSuitable for high-class cleanrooms (up to 10~100 class)
ㆍClean, non-allergic, no particle-generating raw materials were used
ㆍAnti-chemical, anti-corrosion, anti-static
Cleaning]]></description><pubDate><![CDATA[20260209]]></pubDate></item>
<item>
<title><![CDATA[Metal Tube Type Frame]]></title><link><![CDATA[https://acesz.en.ec21.com/Metal_Tube_Type_Frame--11987964_11987975.html]]></link><description><![CDATA[Metal Tube Type Frame
Frame Assembly
Focusing on providing production and assembly services
for structural components, metal frames, PVC coatings, and other products for top semiconductor equipment m]]></description><pubDate><![CDATA[20240819]]></pubDate></item>
<item>
<title><![CDATA[Atmospheric Plasma Cleaning System Chain Conveyor]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Atmospheric_Plasma_Cleaning_System_Chain--11960396_11963494.html]]></link><description><![CDATA[assembly line to improve production efficiency
According to the user&apos;s on-site needs, the optimal assembly line production plan is configured to greatly improve production efficiency.
Product advanta]]></description><pubDate><![CDATA[20240705]]></pubDate></item>
<item>
<title><![CDATA[LED Insert Molding Precision High-speed Punch Hardware Electronic Processing Equipment]]></title><link><![CDATA[https://oreku.en.ec21.com/LED_Insert_Molding_Precision_High--11941325_11951137.html]]></link><description><![CDATA[LED Insert Molding Precision High-speed Punch Hardware Electronic Processing Equipment
What are the structural characteristics of the continuous die used in high-speed punching machines?
Compared wit]]></description><pubDate><![CDATA[20240613]]></pubDate></item>
<item>
<title><![CDATA[Hepa Filter PU Dosing Gluing Machine]]></title><link><![CDATA[https://xd5358840.en.ec21.com/Hepa_Filter_PU_Dosing_Gluing--6307152_10814791.html]]></link><description><![CDATA[LED, optical lens, SMD transformers, relays.2. Communication Products: Keypad, mobile phone casing bonding, radio, telephone, Computers, MP4, electronic toys, chassisbonding, switches, connectors, pl]]></description><pubDate><![CDATA[20240530]]></pubDate></item>
<item>
<title><![CDATA[Controller Module PFSK160A 3BSE009514R1]]></title><link><![CDATA[https://wwww666666.en.ec21.com/Controller_Module_PFSK160A_3BSE009514R1--11939088_11941673.html]]></link><description><![CDATA[assembly. The status of these channels is displayed on the LED on the front panel of FBM240. When 　　is external power applied to the relay contacts of each channel? When the relay contacts close,]]></description><pubDate><![CDATA[20240523]]></pubDate></item>
<item>
<title><![CDATA[Tel Act 8, 12 / Tel Mark Overhaul]]></title><link><![CDATA[https://semiust.en.ec21.com/Tel_Act_8_12_Tel--7745219_7745236.html]]></link><description><![CDATA[Assembly (EBR, Back Side Rinse and Photo Resist Nozzle Tip) manufacture 
- DEV Nozzle Assembly (H, SH, Spray and Stream type) manufacture 
- Plasma to LED LCD modification and Upgrade for TEL MARK by]]></description><pubDate><![CDATA[20140102]]></pubDate></item>
<item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[The company&apos;s main business scope:1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
<item>
<title><![CDATA[Die Casting Products]]></title><link><![CDATA[https://cheevenfsw.en.ec21.com/Die_Casting_Products--11618349_11618359.html]]></link><description><![CDATA[LED lamps. Qiyun takes die casting mold as the main body, integrating product development, mold design, manufacturing and die casting production cooperation as one.
Die Casting Automotive Parts
Die C]]></description><pubDate><![CDATA[20220822]]></pubDate></item>

</channel>
</rss>