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<title><![CDATA[EC21 Product Catalogs - led integrated chips]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/led_integrated_chips--2673/1/led integrated chips.html]]></link><item>
<title><![CDATA[Large Aluminum Alloy Skived Tube Heat Sink for Power System]]></title><link><![CDATA[https://bythermal.en.ec21.com/Large_Aluminum_Alloy_Skived_Tube--12049106_12050197.html]]></link><description><![CDATA[integrated - structure heat sink is carefully
crafted through a specialized Skived Fin machining process in our advanced heat
sink manufacturing facility.​
1. Heat Sink Material
​ We use high -
q]]></description><pubDate><![CDATA[20250318]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[LED semiconductor plastic packaging equipment is used to package LED chips into LED lamp beads. LED chips are usually made of semiconductor materials, while LED lamp beads need to package the chips i]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[LED), radio frequency power transistor, high-power &amp; high-frequency electronic (optoelectronic) devices, the cooling fin of multichip module large-scale integrated circuit, packaging of semiconductor]]></description><pubDate><![CDATA[20230511]]></pubDate></item>

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