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<title><![CDATA[EC21 Product Catalogs - molds for ccd]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/molds_for_ccd--2673/1/molds for ccd.html]]></link><item>
<title><![CDATA[PLC Control IC Chip Molding Machine]]></title><link><![CDATA[https://semiconductormolding.en.ec21.com/PLC_Control_IC_Chip_Molding--11895700_11895701.html]]></link><description><![CDATA[molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;● Full servo control system, PLC (Omron) + controller;● CCD image detectio]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[Ultra Low Humidity Dry Cabinet for MSD IPC/JEDEC J-STD-033]]></title><link><![CDATA[https://eurekamarketing.en.ec21.com/Ultra_Low_Humidity_Dry_Cabinet--9213141_9213204.html]]></link><description><![CDATA[for PCB pattern film/prepreg, quartz, fiber optics, CCDs, etc.
PP plate (prepreg), Solder, Semi-mounted PCB, Mounted PCB, Die Cast &amp; Mold compounds, Bonding materials, Fluorescence powder, LCG board,]]></description><pubDate><![CDATA[20181025]]></pubDate></item>
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<title><![CDATA[LED Molding Equipment / TM10X-Molding Machine]]></title><link><![CDATA[https://llp6258280.en.ec21.com/LED_Molding_Equipment_TM10X_Molding--11840944_11840949.html]]></link><description><![CDATA[for ASM, KNS, Kaijo and other mainstream packaging equipment.Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are ]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

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