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<title><![CDATA[EC21 Product Catalogs - resin bond]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/resin_bond--2673/1/resin bond.html]]></link><item>
<title><![CDATA[Resin Bond Grinding Wheels]]></title><link><![CDATA[https://egrindwheel.en.ec21.com/Resin_Bond_Grinding_Wheels--11777670_11777672.html]]></link><description><![CDATA[Resin Bond Double Disc Grinding Wheels
E-Grind resin bond diamond wheels
are widely used for surface roughing and finishing top and bottom of precision parts, such as compressor cylinder, rotors, aut]]></description><pubDate><![CDATA[20230427]]></pubDate></item>
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<title><![CDATA[Horizontal Plasma System AH-V1000]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Horizontal_Plasma_System_AH_V1000--11960396_11960398.html]]></link><description><![CDATA[Horizontal Plasma System AH-V1000
Descpiton : Plasma treatment is an effective surface processing solution for various materials, including resins, ceramics, metals, and composite materials. It is wi]]></description><pubDate><![CDATA[20240701]]></pubDate></item>
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<title><![CDATA[Sase Diamond Tooling]]></title><link><![CDATA[https://leadingtool.en.ec21.com/Sase_Diamond_Tooling--11940376_11940378.html]]></link><description><![CDATA[bond or 100 grit resin scratches. Will leave a matte finish.
400 Grit - For removal of 100 or 200 grit resin bond scratches. Will leave a honed finish.
APPLICATION:
Floor honing &amp; polishing
Wet cutti]]></description><pubDate><![CDATA[20240521]]></pubDate></item>
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<title><![CDATA[Secura Bolt Rock Bolt for Mining Support]]></title><link><![CDATA[https://sinostone.en.ec21.com/Secura_Bolt_Rock_Bolt_for--4445239_11022825.html]]></link><description><![CDATA[at one end, and torque nut at the other end, to improve resin mixing and consequently provide higher bond strength in larger diameter boreholes.
16mm, 18mm, 20mm, 22mm, 25mm diameter are available.]]></description><pubDate><![CDATA[20240415]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[bonder, DAGE tensile testing machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire we]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Carbon Fiber]]></title><link><![CDATA[https://silkwayankara.en.ec21.com/Carbon_Fiber--11817839_11817840.html]]></link><description><![CDATA[bonding polymer as a stiff resin or plastic, the strenght-to-weight ratio of carbon fiber is much higher than steel or alluminium. 
To explore further collaboration opportunity and obtain additional ]]></description><pubDate><![CDATA[20230711]]></pubDate></item>
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<title><![CDATA[Fully Automatic Solar Laminator]]></title><link><![CDATA[https://solarlaminator.en.ec21.com/Fully_Automatic_Solar_Laminator--11768127_11843811.html]]></link><description><![CDATA[A fully Automatic solar laminator machine is the most important process in the whole solar panel production line. Solar module lamination is used to bond multiple layers of materials (Glass, EVA, Sol]]></description><pubDate><![CDATA[20230912]]></pubDate></item>
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<title><![CDATA[Diamond Grinding Wheel for PCD&amp; PCBN/ Lapidary/Carbide Diamond Polishing Cup Wheel]]></title><link><![CDATA[https://wang12334.en.ec21.com/Diamond_Grinding_Wheel_for_PCD--11597787_11597790.html]]></link><description><![CDATA[resin formula, which is made by hot pressing sintering. The choice of particle size is based on diamond powder, and can also be chose as per customer&apos;s polishing requirements. The resin bond diamond ]]></description><pubDate><![CDATA[20220706]]></pubDate></item>
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<title><![CDATA[Metal Casting Foundry Resin Sand Reclamation Recycling System Molding Processing Foundry Equipment]]></title><link><![CDATA[https://qdhhxsjx.en.ec21.com/Metal_Casting_Foundry_Resin_Sand--11886340_11886325.html]]></link><description><![CDATA[resin sand or silicate bonded sand regeneration. The main 
mode is vibration and friction regeneration, also the function of breaking sand shakeout, sieving, demold.
3. Bucket elevator 
This machine ]]></description><pubDate><![CDATA[20240110]]></pubDate></item>
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<title><![CDATA[Laminating Autoclave]]></title><link><![CDATA[https://ilshinauto.en.ec21.com/Laminating_Autoclave--3722388_4076062.html]]></link><description><![CDATA[resin solution when laminating. This equipment is used for touch panel, mobile phone display, LCD/PDP, Polaroid film and protection film. This process is effective at adhesive bonding, removing bubbl]]></description><pubDate><![CDATA[20180919]]></pubDate></item>
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<title><![CDATA[Controller]]></title><link><![CDATA[https://banseok.en.ec21.com/Controller--3612793_3612941.html]]></link><description><![CDATA[Bond, UV Resin, Silicone, Chip Bond, Oil...
Specification
Input Pressure
0~10ã/ã , 0~2ã/ã 
Time Range
00.01~99.99sec
Interval Timer
0.01~3.99sec, 0.01~05.99min
Vacuum Pressure
0~-35]]></description><pubDate><![CDATA[20100726]]></pubDate></item>

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