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<title><![CDATA[EC21 Product Catalogs - resin chips]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/resin_chips--2673/1/resin chips.html]]></link><item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[chips into LED lamp beads. LED chips are usually made of semiconductor materials, while LED lamp beads need to package the chips in plastic or other materials to protect them from the external enviro]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Metal Bond Diamond Wheel]]></title><link><![CDATA[https://egrindwheel.en.ec21.com/Metal_Bond_Diamond_Wheel--11777670_11777671.html]]></link><description><![CDATA[Resin Bond Grinding Wheels
Henan E-Grind Abrasives Co., Ltd&apos;s Resin cubic boron nitride grinding wheel
consist of resin(phenolic or polyimide), fillers, either diamond or CBN, and wheel cores.
Vitrif]]></description><pubDate><![CDATA[20230427]]></pubDate></item>
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<title><![CDATA[Controller]]></title><link><![CDATA[https://banseok.en.ec21.com/Controller--3612793_4627514.html]]></link><description><![CDATA[Resin, Silicone, Chip Bond, Oil...
Specification
Control method
Electronic / Pneumatic system
Dispensing pressure
0~10kg/cm2(S:Standard), 0~4kg/cm2 (L:Option), 0~2kg/cm2 (P:Option)
Time range
0.001 ~]]></description><pubDate><![CDATA[20100805]]></pubDate></item>

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