<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - semiconductor devices materials]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_devices_materials--2673/1/semiconductor devices materials.html]]></link><item>
<title><![CDATA[Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Communication_Components_Precision_Structural_Components--12057378_12058299.html]]></link><description><![CDATA[Devices
-Thermal Management
-Adjustable coefficient of thermal expansion (CTE)
-Excellent thermal conductivity and heat dissipation performance
Application Fields
-Semiconductor packaging
-Automotive]]></description><pubDate><![CDATA[20260520]]></pubDate></item>
<item>
<title><![CDATA[High Precision Film Fined Resistors]]></title><link><![CDATA[https://xy-resistor.en.ec21.com/High_Precision_Film_Fined_Resistors--12069996_12070002.html]]></link><description><![CDATA[semiconductor devices.
High Precision Film Fined Resistors Rating TYPE
EE1/20
EE1/10
NE1/10
EE1/8
NE1/8
EE1/4
NE1/4
EE1/2
NE1/2
L±0.3
4.30
6.80
10.2
15.1
18.4
D±0.4
1.90
2.50
3.80
5.20
6.50
d±0.05]]></description><pubDate><![CDATA[20260413]]></pubDate></item>
<item>
<title><![CDATA[9MB Electrode for Semiconductor Coating]]></title><link><![CDATA[https://reframetals.en.ec21.com/9MB_Electrode_for_Semiconductor_Coating--12016380_12041517.html]]></link><description><![CDATA[materials. Tungsten&apos;s high melting point and hardness ensure that the electrode maintains a stable structure in the high-temperature environment of semiconductor coating, preventing deformation or da]]></description><pubDate><![CDATA[20250206]]></pubDate></item>
<item>
<title><![CDATA[GOANWIN GP H-Frame High Speed Press for Shaded Pole Motor, Motor Core Lamination]]></title><link><![CDATA[https://goanwin.en.ec21.com/GOANWIN_GP_H_Frame_High--12040893_12041141.html]]></link><description><![CDATA[Device.
- Dynamic balance device.
- Material lubrication device.
- B.D.C Detector.
Optional Accessories 
- Automatic feeder.
- Uncoiler.
- Slide knock-out device.
The GOANWIN GP Series H-Frame High-S]]></description><pubDate><![CDATA[20250203]]></pubDate></item>
<item>
<title><![CDATA[High-Volume Vertical Plasma System AV-P30]]></title><link><![CDATA[https://atvplasma.en.ec21.com/High_Volume_Vertical_Plasma_System--11960396_11960397.html]]></link><description><![CDATA[High-Volume Vertical Plasma System AV-P30
Descpiton :
Plasma treatment is an effective surface processing solution for various materials, including resins, ceramics, metals, and composite materials. ]]></description><pubDate><![CDATA[20240701]]></pubDate></item>
<item>
<title><![CDATA[Pcd530a102 3BHE041343R0102]]></title><link><![CDATA[https://wwww666666.en.ec21.com/Pcd530a102_3BHE041343R0102--11939088_11940331.html]]></link><description><![CDATA[devices for the brake.
　　cease
　　The stop function is used to shut down the machine during normal operation. The stop function is defined by IEC 60204. Category 0: To shut down the driving ma]]></description><pubDate><![CDATA[20240522]]></pubDate></item>
<item>
<title><![CDATA[Pcba,OEM,Odm,Ems]]></title><link><![CDATA[https://juliazhu1029.en.ec21.com/Pcba_OEM_Odm_Ems--11897693_11897698.html]]></link><description><![CDATA[We are committed to providing global customers with manufacturing services for computers and storage, semiconductors, medical devices, automotive electronics, commercial and industrial products, and ]]></description><pubDate><![CDATA[20240205]]></pubDate></item>
<item>
<title><![CDATA[3D Printing Services]]></title><link><![CDATA[https://greatlight001.en.ec21.com/3D_Printing_Services--11610218_11619992.html]]></link><description><![CDATA[Material: Titanium Alloy, Nickel-titanium Alloy and other Materials
Automotive Manufacturing
3D printing in automotive manufacturing applications mainly for fluid and cooling devices, fixture, interi]]></description><pubDate><![CDATA[20220823]]></pubDate></item>
<item>
<title><![CDATA[Semiconductor Plastic Packaging Equipment / Photoelectric Semiconductor Packaging System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Packaging_Equipment_Photoelectric--11840944_11840952.html]]></link><description><![CDATA[semiconductor plastic packaging equipment is used to produce LED backlights, including backlights for various electronic devices such as TVs, mobile phones, and tablet computers.
Automotive lighting:]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
<item>
<title><![CDATA[DC/DC Converter Unit]]></title><link><![CDATA[https://empevmobility.en.ec21.com/DC_DC_Converter_Unit--11907616_11907625.html]]></link><description><![CDATA[semiconductor devices, and control circuitry. The input voltage is connected to the input terminals, while the output voltage is obtained from the output terminals.
DC/DC Converter In Electric Vehicl]]></description><pubDate><![CDATA[20240229]]></pubDate></item>
<item>
<title><![CDATA[CNC Metal Machining Parts High Precision Used for Medical Devices]]></title><link><![CDATA[https://kunshanpenas89.en.ec21.com/CNC_Metal_Machining_Parts_High--11856398_11856403.html]]></link><description><![CDATA[CNC Metal Machining Parts High Precision Used for Medical Devices
Main processing materials:
Imported domestic carbon steel, die steel, manganese steel, alloy steel, tool steel, high-speed steel, 304]]></description><pubDate><![CDATA[20231020]]></pubDate></item>
<item>
<title><![CDATA[PLC Control IC Chip Molding Machine]]></title><link><![CDATA[https://semiconductormolding.en.ec21.com/PLC_Control_IC_Chip_Molding--11895700_11895701.html]]></link><description><![CDATA[PRODUCT DESCRIPTIONChip Molding Machine Features● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;● Full servo c]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
<item>
<title><![CDATA[Direct Drive Linear Motion Devices Torque Motor]]></title><link><![CDATA[https://cskhh.en.ec21.com/Direct_Drive_Linear_Motion_Devices--11859093_11907840.html]]></link><description><![CDATA[Semiconductor Manufacturing: Used in wafer handling and scanning applications.
Aerospace: Direct Drive Motors are utilized in motion control systems for aircraft control surfaces.
Medical Devices: In]]></description><pubDate><![CDATA[20240301]]></pubDate></item>
<item>
<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[devices. Furthermore, the diamond is a typical insulator due to its resistivity is as high as 1016 Ω. Therefore, the diamond is the most ideal material for thermal sink. It mainly applies to the arr]]></description><pubDate><![CDATA[20230511]]></pubDate></item>

</channel>
</rss>